Call for Abstracts for Speakers
Silicon photonics and photonic integrated circuits (PICs) are entering a new phase of development as the industry moves beyond medium-scale integration toward large-scale photonic integration. The rapid growth of AI infrastructure, high-performance computing, and advanced sensing is accelerating demand for high-bandwidth, energy-efficient optical interconnects and scalable photonic systems.
Recent advances in heterogeneous integration, integrated lasers, co-packaged optics, and advanced packaging technologies are enabling new levels of performance and integration density. However, several challenges remain across the ecosystem, including modulator performance, scalable manufacturing, fiber-to-chip coupling, packaging design rules, thermal management, and system-level integration.
This session invites abstracts highlighting advances in photonic devices, integration technologies, manufacturing approaches, and emerging applications that will enable the next generation of photonic systems.
TOPIC AREAS
Session will include (but not limited to) topics within:
- Silicon photonics devices and integrated lasers
- Co-packaged optics and optical interconnects for AI and data centers
- Photonic integration, heterogeneous integration, and chiplet architectures
- Advanced packaging, interconnection, and fiber-to-chip coupling
- LiDAR and photonic sensing for autonomous systems
- Photonic computing, optical interconnects, and quantum photonics
IMPORTANT INFORMATION & 2027 DEADLINES
Deadlines | Information |
Oct 7 | Call for Abstracts Open |
Nov 23 | Abstract Submissions Deadline |
Jan 8 | Author and Speaker Notification |
Mar 15 | Speaker Portal Tasks Due |
Mar 15 | Final PPT Due (16:9 display format) and PDF Versions |
QUESTIONS?
Contact Gity Samadi
Sr. Director, R&D, SEMI
[email protected]
Pushkar Apte
Strategic Technology Advisor, SEMI
papte@semi.org
SPEAKER REQUIREMENTS
If your abstract is accepted and you are invited to present, please complete these requests:
- Speaker agreement
- Headshot and short bio (<500 words)
- PowerPoint slide presentation (16:9 format)
- PDF for distribution to attendees
- Identify a replacement speaker if unable to attend