Advanced Packaging & Heterogeneous Integration Summit
As AI and high-performance computing redefine semiconductor value creation, advanced packaging has become the system, and the primary lever for scaling performance, power, and cost. This summit brings together leaders from across the ecosystem to connect business drivers and roadmap choices (chiplets, 2.5D/3D, HBM, co-packaged optics) with the critical constraints shaping time-to-volume, including thermal density, metrology and inspection limits, yield, and supply chain capacity. Sessions will highlight the latest technology advances, manufacturing readiness, and ecosystem collaboration needed to move heterogeneous integration from innovation to high-volume deployment.
Tuesday, October 13, 2026
10:30am–5:15pm PT
- Power & Thermals I—Thermal is the New Node: Managing Power in 3D Systems
- Metrology & Inspection: The Gatekeepers of Yield in Advanced Packaging
- Co-Packaged Optics (CPO): Powering the Next Wave of AI Connectivity
Wednesday, October 14, 2026
10:30am–5:20pm PT
- Equipment Frontiers for Advanced Packaging—From Hybrid Bonding to Co‑Packaged Optics
- Federal Programs Driving Advanced Packaging—ME Commons & NGMM (Status & Challenges)
- Federal Research for the Future—NSF & CRDO in Technology and Workforce Development
RECEPTION
- Wednesday, Oct 14, 5:00-6:00 PT
SPONSOR
