Material Innovations for Enabling Future Computing
Wednesday, October 14, 2026
10:30am–12:35pm and 2:30–6:30pm PT
SESSIONS
Future computing platforms, from AI infrastructure and advanced communications to power electronics, photonics, and quantum computing, will increasingly be enabled by innovations in semiconductor materials. Meeting these challenges requires leveraging and improving technologies developed from substrates to packaging, from lithography to interconnect, from high-temperature to millikelvin, in ultraclean environments ranging from supercritical to ultrahigh vacuum. Innovation is key, but it needs to be mated with fast, effective scaling to meet the technological challenges as well as the demanding timelines inherent to the semiconductor industry.
Join us as experts from all corners of the semiconductor materials industry gather to discuss these challenges and present the latest developments in materials, materials processing, and applications.