Special Track: Future Technology
Discover the Technologies Shaping What's Next
The Future Technology track showcases the innovations that will shape the next decade of the semiconductor industry and the technologies it enables. Explore advances in artificial intelligence, quantum technologies, photonics, flexible hybrid electronics, robotics, and smart medical technologies that are driving new capabilities across healthcare, mobility, communications, and industrial applications. Hear from industry leaders, researchers, and innovators as they discuss emerging technology trends, commercialization pathways, and the breakthroughs that will transform tomorrows connected and intelligent world.
FHE: Bridging Semiconductors, AI, and Intelligent Systems
Tuesday, October 13, 2026
10:30am–12:30pm PT
Location: Moscone Center, South Hall, Upper Mezzanine, Room 160
SESSION
Flexible Hybrid Electronics (FHE) is transforming the design and deployment of next-generation electronic systems by merging technologies in semiconductors, advanced manufacturing, printed electronics, and flexible substrates. This enables lightweight, conformal, and highly integrated systems capable of real-time sensing, communication, and intelligent decision-making. As demand grows for smarter robotics, wearable health technologies, distributed sensing networks, and autonomous systems, FHE is emerging as a critical platform for innovation. This session will explore advances in additive manufacturing, heterogeneous integration, advanced materials, embedded AI, and digital engineering that are accelerating the development and commercialization of flexible electronic systems.
Topic Areas
• Advanced Manufacturing and Heterogeneous Integration for Flexible Systems
• Materials Innovation, Energy Harvesting, and Power Management
• Intelligent Sensing, Edge Computing, and Embedded AI
• Robotics, Tactile Sensing, and Human-Machine Interfaces
• Wearable Technologies and Digital Health Applications
• High-Performance Communications and Connected Systems
• Digital Twins, Design Tools, and Scalable Deployment of FHE Solutions
From Silicon to Care: Enabling the Next Era of Smart MedTech
Tuesday, October 13, 2026
2:00–4:00pm PT
Location: Moscone Center, South Hall, Upper Mezzanine, Room 152
SESSION
Smart MedTech at SEMICON West 2026 highlights the importance of semiconductor innovation and medical technology. As advanced chips enable smarter diagnostics, connected devices, and precision therapies, the path from breakthrough to real-world healthcare application is accelerating. This program explores how emerging technologies are shaping the future of care and expanding the role of semiconductors across the evolving medtech ecosystem.
Topic Areas
• The Convergence of Semiconductors and Medical Technology
• Advanced Sensors, Wearables, and Continuous Health Monitoring
• Connected Medical Devices and Remote Patient Monitoring
• AI, Data, and Personalized Medicine
• From Innovation to Adoption: Regulatory, Security, and Reliability Challenges
• Building the Next-Generation MedTech Ecosystem
Future of AI Computing: Bending the Curve for Radical Efficiency Improvement
Wednesday, October 14, 2026
10:00am–12:00pm PT
SESSION
Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. This promises many economic and social benefits, but this trajectory is now testing energy availability limits and power consumption has become the significant limiter to performance gains. The global “data center gold rush” is already straining energy grids around the world and may slow AI’s progress. To address this formidable challenge, radical efficiency improvement in both performance and energy consumption is needed. This requires radical innovation, not just by individual segments, but by meaningful collaboration that “connects the dots” across the entire system stack.
Silicon Photonics and Photonic Integrated Circuits: Scaling Toward the Next Era
Wednesday, October 14, 2026
1:00–4:00pm PT
Location: Moscone Center, North Hall, Lower Level, Room 20
SESSION
Silicon photonics and photonic integrated circuits (PICs) are entering a new phase of development as the industry moves beyond medium-scale integration toward large-scale photonic integration. The rapid growth of AI infrastructure, high-performance computing, and advanced sensing is accelerating demand for high-bandwidth, energy-efficient optical interconnects and scalable photonic systems.
Recent advances in heterogeneous integration, integrated lasers, co-packaged optics, and advanced packaging technologies are enabling new levels of performance and integration density. However, several challenges remain across the ecosystem, including modulator performance, scalable manufacturing, fiber-to-chip coupling, packaging design rules, thermal management, and system-level integration.
This session highlights advances in photonic devices, integration technologies, manufacturing approaches, and emerging applications that will enable the next generation of photonic systems.
Future of Computing: Emerging Quantum Revolution
Wednesday, October 14, 2026
1:00–4:00pm PT
SESSION
Artificial intelligence (AI) is scaling at a pace that is reshaping semiconductor roadmaps, data center design, and long-term infrastructure strategy. This promises many economic and social benefits, but this trajectory is now testing energy availability limits and power consumption has become the significant limiter to performance gains. The global “data center gold rush” is already straining energy grids around the world and may slow AI’s progress. To address this formidable challenge, radical efficiency improvement in both performance and energy consumption is needed. This requires radical innovation, not just by individual segments, but by meaningful collaboration that “connects the dots” across the entire system stack.