Platinum Sponsor—KLA
KLA Corporation | Booth 1333
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward.
Featured Content
Artificial Intelligence
AI is a transformative technology. By enhancing efficiency, driving innovation and empowering data-driven decisions, AI is revolutionizing industry, science, creativity and experiences. Semiconductors are at the center of this AI revolution – chip technology drives AI innovation and AI enables next-gen chip performance. As AI and semiconductor technologies progress in unison, they shape the future of AI, unlocking new opportunities and defining the future of our digital world.
Advanced Packaging
Semiconductor packaging has evolved beyond protecting and connecting chips to powering device performance. Traditional transistor scaling continues, with packaging advancements further enhancing functionality. KLA’s experience solving front end yield challenges paired with our differentiated advanced packaging system portfolio make us an ideal partner for advancing connectivity in this expanding market.
Automotive
As vehicles become more electrified, connected, and autonomous, semiconductor content per car is rapidly increasing along with the demand for zero-defect performance. Chips now control mission-critical functions, from basic operation and safety to infotainment and increasingly autonomous driving. To meet stringent automotive safety and reliability standards, every chip must perform perfectly—every time. Achieving this requires advanced screening and process control to catch defects traditional methods and testing may miss, including latent issues that could emerge under real-world driving conditions.