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CFA Submission Deadline November 23, 2026

Call for Abstracts for Speakers + Posters

Test Vision Symposium at SEMICON West 2027


ENGINEERING TRUST IN SILICON

Silicon powers AI, autonomy, electrification, connectivity, and critical infrastructure. Test is becoming the foundation of trust across the semiconductor ecosystem. From design validation to production ramp and lifecycle reliability, test proves that complex devices can perform safely, securely, and consistently.

Test Vision Symposium invites abstracts that show how the ecosystem can build greater confidence in silicon- from chiplets and advanced packaging to AI-driven analytics, power and thermal stress, system-level test, security, and resilient manufacturing. We welcome practical, forward-looking submissions across the topic areas below.

TOPIC AREAS

  • Test Ecosystem and Supply Chain
    • AI-driven capacity and utilization
    • Chiplet, advanced-package, and known-good-die readiness
    • Critical hardware sourcing and secure data exchange
    • Partner readiness across ATE, OSAT, foundry, and fabless teams
       
  • Power, Thermal & Energy-Aware Test
    • Co-packaged power and dynamic power test
    • Wide bandgap, high-voltage, and isolation test
    • BMS, PMIC, IVR, and thermal-aware test
    • Energy-efficient test strategies
       
  • Intelligent Test Infrastructure
    • Wafer, panel, probe, socket, and interconnect innovation
    • Robotic handling, thermal control, and multisite automation
    • AI/ML analytics, diagnostics, EDA-to-ATE, and trusted test data
    • Adaptive test flows from real-time manufacturing data
       
  • Emerging Devices, Interfaces & Platforms
    • High-speed interfaces, die-to-die links, and CXL/UCIe
    • Smart sensors, AI vision, photonics, RF/mmWave, and 6G
    • Advanced display, HBM, and memory-centric compute test
    • Automotive, edge AI, and mission-critical compute platforms
       
  • Next-Generation Test Methods
    • On-die agents, system-level test, and silicon co-simulation
    • AI-assisted development, post-silicon debug, and portable flows
    • In-field telemetry, predictive reliability, and lifecycle monitoring
    • Reliability, secure operations, software-defined test, and hardware security


IMPORTANT INFORMATION & 2027 DEADLINES
 

Deadlines

Information

Oct 7

Call for Abstracts Open

Nov 23

Abstract Submissions Deadline

Jan 8

Author and Speaker Notification

Mar 15

Speaker Portal Tasks Due

  Mar 15

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Basak Ulutas Ozturkler
[email protected]

 

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend