Call for Abstracts is Now Closed

Smart Manufacturing at SEMICON West 2026

The semiconductor industry is undergoing a structural transformation driven by the convergence of agentic AI, physical intelligence, lights-out automation, and geopolitical supply chain realignment. Gartner estimates that 60% of manufacturers will adopt some form of lights-out manufacturing by 2026, while McKinsey projects agentic AI will generate up to $650 billion in additional revenue by 2030 across industries. At the same time, CHIPS Act investments in the U.S. are entering full execution, creating a new wave of greenfield fab ramp-ups that demand the latest in smart manufacturing capabilities.

The 2026 Smart Manufacturing Pavilion will spotlight the technologies, implementations, and strategies that are making the autonomous semiconductor factory a reality — from agentic AI and large language models running fab operations, to humanoid robots performing production tasks for the first time in chip fabs.

Thank you for your interest. 

Submit your abstract today and highlight your capabilities.

Note 1: The Smart Manufacturing Pavilion is to highlight capabilities and use cases for Industry4.0/Smart Manufacturing in semiconductor operations. Submissions with use cases, and implementation examples will receive priority.

Note 2: Priority will also be given to new work, latest results and novel applications within the topic/sub-topic areas identified.

TOPIC AREAS

Sessions will include (but not limited to) topics within:

  • Supply Chain
    • Risk & Resilience: Mapping Critical Supply Chain Vulnerabilities 
      • Multi-tier supplier mapping and dependency visualization
      • Geopolitical risk scoring frameworks for sourcing decisions
      • Single-point-of-failure identification in specialty chemicals and substrates
      • Dual-sourcing, qualification acceleration, and buffer inventory strategies
      • Early warning systems for supplier financial health and regional instability 
    • Advanced Packaging Supply Chains – Capacity & Choke Points 
      • HBM supply chain: production allocation, qualification, and co-packaging readiness
      • Substrate supply constraints: organic, silicon, glass — capacity roadmaps
      • 2.5D/3D stacking, fan-out wafer-level packaging, and chiplet integration supply chains
      • OSAT strategy: captive vs. outsourced advanced packaging decisions  
      • Co-packaged optics (CPO) supply chain readiness for data center applications 
    • Smart Manufacturing & AI-Driven Fab Operations  
      • Digital twins for supply chain simulation and disruption scenario planning
      • Real-time supplier monitoring: financial health, geopolitical signals, capacity alerts
      • AI-powered demand sensing and inventory optimization in volatile markets
      • Human-AI collaboration frameworks in safety-critical fab environment 
    • Regionalization & Geographic Diversification 
      • Multi-hub fab strategies: cost models for Taiwan+US vs. full geographic split
      • Southeast Asia and India as emerging assembly/test hubs: capability gaps and investment needs
      • Co-location requirements for advanced packaging ecosystems (OSATs, substrate, EDA)
      • Japan and Germany as specialty semiconductor manufacturing centers
      • Supply chain governance across multi-jurisdictional regulatory environments 
         
  • Digital Twins & Industrial Intelligence—From Fab to Ecosystem
    • Holistic digital twin across the value chain: integrating design, operations, tool, yield & supply chain
    • Contextualized data lakes and semantic data layers for advanced AI insights
    • Extending Digital Twins into factory / subfab / facilities and the Industrial Metaverse
    • High-resolution simulation & modeling for greenfield and brownfield fab ramp-up
    • Advanced performance metrics, reporting & real-time visualization
    • End-to-end trusted traceability and digital thread integration (PLM, MES, EDA, AMHS)
    • SEMI EDA standards (GEM, GEM300, Interface A/EDA) enabling AI-ready equipment data
    • Developing digital-savvy manufacturing talent and workforce upskilling
       
  • Agentic AI & LLMs in Manufacturing Operation
    • Autonomous Run-to-Run (R2R) control & process optimization using agentic AI
    • LLMs and foundation models for manufacturing analytics, yield analysis & process engineering
    • AI/ML-based Smart FDC, YMS, SPC, and virtual metrology with agentic orchestration
    • AI-Based Yield Optimization across chiplet-based and heterogeneous designs
    • AI-driven anomaly detection, pattern and trace classification
    • Predictive and prescriptive AI maintenance & prognosis health monitoring
    • Look-ahead scheduling, line balancing & intelligent workflow automation
    • Smart inspection, metrology sampling optimization, and AI-driven quality systems
    • Responsible AI: transparency, explainability, and de-risking AI adoption in fabs
       
  • Physical AI & Humanoid Robotics in Semiconductor Manufacturing
    • Humanoid and collaborative robots in fab logistics, assembly, and inspection tasks
    • Physical AI platforms (NVIDIA Cosmos/GR00T, Siemens-NVIDIA Industrial AI OS) for semiconductor manufacturing
    • Vision-Language-Action (VLA) models enabling autonomous robot task learning in fabs
    • Integration of AGVs, AMRs, cobots and humanoids into AMHS workflows
    • Human-robot collaboration: safety, certification, and operational standards
    • Reducing automation project timelines: from months to days with AI-native robotics platforms
    • Edge AI chiplets and heterogeneous SoCs powering factory robots
    • Workforce evolution: upskilling, new roles, and human-AI-robot teaming
       
  • Automation & Equipment Toward Fully Autonomous Factories & Facilities (200/300mm Fabs, Back-End Advanced Packaging & Test (APT) Lines)
    • Digital Threads connecting design, manufacturing execution, and operations
    • Future of Automated Material Handling Systems (AMHS) in legacy fabs and back-end APT lines
    • Next-generation material handling: integrating AGVs, AMRs, and humanoid cobots
    • Smart Subfab monitoring & optimization (Power/Abatement/Integrated with tool FDC)
    • Human capital evolution in smart manufacturing (skills augmentation, co-bots, new roles)
    • Standards development and augmentation (SEMI E30/GEM, E87/AMHS, cybersecurity standards)
    • Fully autonomous 200mm fab strategies: making legacy lines competitive
       
  • Energy-Smart Manufacturing — Power, Sustainability & Net Zero
    • AI/ML algorithms for real-time energy optimization in wafer process tools and subfab equipment
    • Smart power management: digital twins for fab energy monitoring, stability, and efficiency
    • Generative AI and simulation modeling for energy/water usage in brownfield/greenfield sites
    • OEE, FDC & predictive maintenance for water & chemical systems
    • Water management: liquid chemical and toxic gas waste reduction and recycling
    • Pollution & airborne molecular contamination IoT tracking and alerting
    • Big Data and Cloud architecture for sustainability dashboard metric optimization
    • Renewable energy integration, carbon accounting, and scope 3 supply chain emissions
    • Collaborative industry programs (e.g., semiconductor supplier sustainability initiatives)
       
  • Heterogeneous Integration & Advanced Packaging Smart Manufacturing
    • AI-driven yield management for chiplet-based and heterogeneous integrated packages
    • Smart inspection and metrology for advanced packaging (Fan-Out WLP, HBM, 2.5D/3D, co-packaged optics)
    • Digital twins for advanced packaging process optimization and virtual qualification
    • Automated test strategies for complex multi-die packages
    • Data integration across chiplet design, packaging, and test flows
    • Smart back-end APT line automation: AGVs, AMRs, and robotic handling for advanced packages
    • SEMI standards for advanced packaging manufacturing data and equipment communication
    • Emerging smart manufacturing solutions for sub-angstrom node and next-generation process nodes

 

IMPORTANT INFORMATION & 2026 DEADLINES

Deadlines

Information

March 18

Call for Abstracts Open

June 1

Abstract Submissions Deadline

July 14

Author and Speaker Notification

July 24

Speaker Portal Tasks Due

September 15

Draft Presentation for Review

  September 29  

  Final PPT Due (16:9 display format) and PDF Versions  


QUESTIONS?

Contact Anshu Bahadur
[email protected]

or 

Taylor Zhao
[email protected]

 

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend