2027 Call for Abstracts Opens Soon

New Materials (EMG) at SEMICON West 2027

Breaking Performance Barriers with Materials Innovation 

Material-driven innovation is critical to addressing the scaling, power, and architectural bottlenecks of the AI ecosystem. As advanced semiconductor applications evolve toward disaggregated memory solutions, optical interconnects, and 3D integration, quantum computing, material engineering enables breakthroughs across three key pillars: 

  • Advanced Memory Architectures:
    •  Leveraging CXL, photonics, and high-bandwidth solutions (including HBF, HBM, and emerging non-volatile memories like ReRAM and MRAM) supported by thermal management and advanced packaging innovations to overcome the memory wall.
  • Power Efficiency:
    •  Deploying wide-bandgap materials (GaN, SiC) and Power SOI to optimize power conversion, reduce latency at the PMIC level, and support high-load architectures up to 800V and beyond.
  • Front-End and 3D Integration: 
    • Advancing thin-film processing, stacked transistor architectures (CFET), and 3D DRAM manufacturing through precise interface control, overlay accuracy, and novel deposition techniques. Novel deposition technique 


This session invites abstracts highlighting advances in material science, integration technologies, manufacturing approaches, and emerging applications that will enable the next generation of data center applications.

Session will include (but not limited to) topics within: 

  • Wide band gap materials for power conversion  
  • Integration of Thermal dissipation materials for heat sensitive IC’s
  • Emerging Process technology for high aspect ratio memory architecture technology    
  • Materials for area selective deposition and etching and cleans processes and technologies
  • Front end compatible heterogenous packaging  
  • Materials for Silicon photonics devices and integrated lasers  
  • Materials for optimizing power efficiency, for example in data centers, vertical power devices, electrification 


IMPORTANT INFORMATION & 2027 DEADLINES
 

Deadlines

Information

TBC

Call for Abstracts Open

TBC

Abstract Submissions Deadline

TBC

Author and Speaker Notification

TBC

Speaker Portal Tasks Due

TBC

Draft Presentation for Review

  TBC  

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Gity Samadi
Sr. Director, R&D, SEMI 
[email protected] 
 

SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend