2027 Call for Abstracts Opens Soon

Advanced Packaging & Heterogeneous Integration Summit at SEMICON West 2027

TOPIC AREAS

Session will include (but not limited to) topics within:

  • Scaling Heterogeneous Integration: From Chiplets to Systems
    • Chiplet interoperability and standards (UCIe, die-to-die interfaces, multi-vendor marketplaces)
      2.5D/3D integration and hybrid bonding (pitch scaling, yield, manufacturing readiness)
       
  • Power, Thermal and Physical Limits of AI-Era Packaging
    • Power delivery in-package (integrated VRMs, GaN, backside power delivery networks)
      Advanced thermal solutions (microfluidics, two-phase cooling, liquid-cooled packages)
      Co-design across silicon, package, and system (thermal-aware EDA, digital twins)
       
  • Photonics, Materials and Board Level Frontier
    • CPO-Co-packaged optics (optical I/O chiplets, interconnect, silicon photonics integration, fiber attach)
      Advanced materials and substrates (glass/panel substrates, liquid metals, low-loss dielectrics)
      Extending heterogeneous integration to the board level (System-on-Package, panel-to-board convergence, co-design across the package/PCB boundary
       

IMPORTANT INFORMATION & 2027 DEADLINES

Deadlines

Information

TBC

Call for Abstracts Open

TBC

Abstract Submissions Deadline

TBC

Author and Speaker Notification

TBC

Speaker Portal Tasks Due

TBC

Draft Presentation for Review

  TBC  

  Final PPT Due (16:9 display format) and PDF Versions  

 

QUESTIONS?

Contact Gity Samadi
Sr. Director, R&D, SEMI 
[email protected] 

Pushkar Apte
Strategic Technology Advisor, SEMI
papte@semi.org 


SPEAKER REQUIREMENTS

If your abstract is accepted and you are invited to present, please complete these requests:

  • Speaker agreement
  • Headshot and short bio (<500 words)
  • PowerPoint slide presentation (16:9 format)
  • PDF for distribution to attendees
  • Identify a replacement speaker if unable to attend