Advanced Lithography

 

Wednesday, July 13

10:30am-12:30pm

NorthOne TechXPOT

  Session Sponsor:
     
Description

Listen to experts discuss the readiness of EUV lithography for patterning critical layers, including the mask infrastructure. A separate panel will describe direct-write e-beam, and methods to extend 193 nm scanners.

   
Agenda  

EUV Lithography

     
10:30am-10:40am  

EUV LPP Sources for High Volume Manufacturing
David Brandt
Cymer

   

 

10:40am-10:50am    EUV DPP Sources, Status and Roadmap

Presentation in PDF

Marc Corthout, Ph.D. (Biography)
President 
XTREME Technologies GmbH

   

 

10:50am-11:05am  

Presentation not available

Skip Miller (Biography)
Director of Strategic Marketing
ASML

   

 

11:05am-11:20am

 The EUV Mask Infrastructure

Presentation in PDF

Stefan Wurm, Ph.D. (Biography)
Associate Director of Lithography
SEMATECH

     
11:20am-11:30am  

Q&A

Moderated by David Lammers

     
    Extended 193nm and E-beam
     
11:30am-11:45am

Toolbox for Optical Lithography Extension
 Presentation in PDF

Martin McCallum, Ph.D. (Biography)
Program Manager, Advanced Lithography and Technology Department
Nikon Precision Europe

     
11:45am-12:00pm  

Frequency Multiplication Technology for 15nm and Below
Chris Bencher (Biography)

Member, Technical Staff, Office of the CTO

Applied Materials

     
12:00pm-12:15pm

Extending Optical Lithography with CEBL (Complementary E-Beam Lithography)

Presentation in PDF

David Lam, Ph.D. (Biography)

Chairman and CEO
Multibeam

     
12:15pm-12:30pm  

Q&A

Moderated by David Lammers
     

 


 
Bookmark and Share Google+