In her current role, Rozalia leads strategic marketing activities across Electronics & Imaging Division. She has 27 years of international working experience across various industries, including industrial, electronics and semiconductors. For 20 years she was involved in the research, applications and strategic marketing of Advanced Packaging technologies, with global leading responsibilities at specialty chemicals (Rohm and Haas Electronic Materials), equipment (Semitool, Applied Materials and Lam Research) and device manufacturing (Maxim IC). Prior to joining DuPont, Rozalia was the CTO of Yole Développement where she led the market research, technology and strategy consulting activities for Advanced Packaging and Semiconductor Manufacturing. Throughout her career, Rozalia has been actively supporting industry activities worldwide: Program Director of EMC3D Consortia, General Chair of IMAPS Device Packaging and Global Semiconductor and Electronics Forums, Technical Advisory Board Member at SRC, Member of the Executive Committee of ECTC, IMAPS SiP, ISQED, ESTC and member of several committees worldwide (ITRS, IWLPC, EPTC and EPS). Current industry involvements include: IMAPS VP of Technology, Technical Chair IMAPS Advanced SiP USA and SiP China Symposium, ECTC Assistant Program Chair, HIR WLP Chair, Advisory Board Member of 3DinCites and IMPACT Taiwan. She has over 150 presentations and publications (including 3 book chapters on 3D IC technologies), several keynotes, invited presentations and panel participations. Rozalia has a M.Sc. in Chemical Engineering from Polytechnic University "Traian Vuia" (Romania), a M.Sc. in Management of Technology from KW University (USA), and a Global Executive MBA from Instituto de Empresa Business School (Spain).