Rahul Manepalli

Sr. Principal Engineer

Senior Engineering Manager, Technical Leader with 20+ years of experience in the electronic packaging industry in package assembly, embedded die packaging and IC substrates. Proven ability to thrive in a startup environment, in developing people, and building and leading high performance teams. Recognized leader in shaping and managing large teams with complex scope including Materials and Supplier development, Process technology startup and development , Yield improvement, Cost reduction and Equipment Development.

Innovator, Problem solver and technical leader with over 50 patents/patent applications in packaging architectures, materials, 25+ papers and publications in the area of semiconductor packaging.

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