Dr. Yun works in the field of analog RF and power technology. He has led more than 30 projects to develop, calibrate and optimize the power device characteristics using TCAD solutions. His research interests are focused on electro-thermal package/die modeling and reliability simulation of Electrostatic Discharge (ESD), Safe Operation Aare (SOA) for power devices and SPICE macro model extraction of power electronics system. His accomplishments include development of a “Chip to Package and System (CPS) analysis methodology” for power IC process, power device design and electronics system design. Chan-Su received his B.S. and M.S. degrees in electronic engineering from Chung-Ang University, Korea in 1986 and 1993, and Ph.D. degree in Integrated Systems Laboratory of the Swiss Federal Institute of Technology (ETHZ), Switzerland in 2000.