Brian Coppa

Principal Applications Engineer
EMD Performance Materials

 Brian J. Coppa, Ph.D., has nearly two decades of industry experience in microelectronics R&D and production from the Micron/Intel memory joint venture, ASM, and TEL, and as a consultant to several other leading companies in the field previously. He has authored over 15 US and foreign patent publications and numerous technical journal articles, which have received many prestigious citations globally. Brian is a Senior Member of the Institute of the Electrical and Electronics Engineer (IEEE) Society, Materials Research Society (MRS), and a co-chair of the SEMI Standards Americas Smart Manufacturing Council. Currently, Brian is a Principal Applications Engineer for EMD Performance Materials, a branch of Merck KGaA, focused on chemical delivery solutions for semiconductor manufacturing. His specialties in smart manufacturing include preventive maintenance, fault detection, digital twins and overall advanced process control solutions.

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