Advanced Sub-Surface Inspection Strategies for Advanced Packaging
The advanced packaging industry continues to grow: Demands on bandwidth and device integration lead to increased package density and dramatically increased device pin counts. And along with that, the criticality of advanced devices is also increasing, with new applications in transport, defense, 5G communications, and datacenters. These applications critically require reliabilities at the ppm level, while also requiring the most advanced silicon and packaging technologies.
These trends together create the need for new strategies in advanced packaging metrology, inspection, and control. SVXR has developed both advanced x-ray inspection (AXI) hardware and software tools that allow inspection at part per million defect rates, and allow cost-effective control strategies.
The sampling challenges for both control and inspection for high reliability require systems that can run at 100% coverage and millions of units per year. An overview of reliability sampling challenges as it relates to the end of line inspection, as well as sampling for both defect type and incidence, is critical to understanding how and what to measure—both critical defectivity and metrology. There are fundamental tradeoffs between speed, resolution, and signal to noise ratio that inform a systematic engineering understanding of inspection.