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[Test] Test Vision Symposium: Expanding the Role of Test

“Moore’s Law” and “More than Moore” packaging advancements still guide our roadmaps as the race for denser, larger, faster and highly heterogeneous devices continues. Now, add the near-instantaneous time-to-market imperatives and the new challenges of 7nm processes and beyond, and the test complexities intensify. This calls for new innovations in DFT, test methodologies, wafer probing technology, and device manufacturing - to build valuable solutions for test IP and equipment developers, as well as tool providers and users. So, at Test Vision Symposium, we’ll ask questions like this: What can we do differently to provide testing cost-effectively with dppm rates approaching zero? What R&D tools are needed for today’s and tomorrow’s devices? What will test cell (ATE, fixtures, handlers, or probers and probe cards) need to look like in 2020 and beyond? How can test be better integrated into the manufacturing process? Are today’s technologies adequate for the future? If not, what can we do to close the gap?


Poster Session: Optimization Techniques for C-Bit Utilization on the ETS-364

Alex Saenz

Texas Instruments

Poster Session: Democratizing Deep Learning to Accelerate Image Based Defect Inspection

Sindhu Ramachandran

QuEST Global

Gina Mathew

QuEST Global

Poster Session: Novel Airborne-Based Particle Measurement Methodologies

Yitzhak Vanek

Persys Group

Phase Contrast X-ray Micro-CT for Non Destructive Imaging of LEDs

Karim S Karim

KA Imaging

Advanced Sub-Surface Inspection Strategies for Advanced Packaging

Scott Jewler


Laser Based 3D-Magnetic Field Sensor Formation

Hans-Ulrich Zuehlke

3D-Micromac AG

Smart Factory for Inspection in the Semiconductor Industry

Ragnar Vaga

YXLON International GmbH

Thorsten Rother

YXLON International GmbH