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[LIVE] Moore's Law Enablers

Tuesday, July 21 | 10:30 am - 11:30 am

Session Abstract

As semiconductor technology proceeds beyond “classical” scaling, novel solutions are explored, allowing for the creation of 3-D structures built at the atomic scale. Such technologies include Atomic Layer Deposition (ALD) and Etching (ALE) and Area Selective Deposition (ASD); corollary techniques are implemented still at an atomic scale to create monolayer masks, using Self Assembled Monolayers (SAM’s) and other novel patterning technologies. In addition, Heterogeneous Integration allows to optimize assembly real estate by chip “stacking”, with innovative schemes for interconnects in the z axis, affording new pathways to packaging, and enabling next-gen technologies, like 5G and IoT.

 

[On-Demand] Moore's Law Enablers

Agenda

Directed Self Assembly: Supply Chain Ecosystem Enablement

Chandrasekhar Sarma

Intel
10:30 am - 11:00 am

Heterogeneous Integration & Materials Applications

Speaker to be Announced

11:00 am - 11:30 am