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[SMART Mobility] Materials and Packaging for Automotive Semiconductors

Agenda

Automotive Package Reliability Requirements: Challenges and Opportunities

Przemyslaw Gromala

Robert Bosch GmbH

Automotive Semiconductor Packaging – Trends, Challenges and Solutions

Prasad Dhond

Amkor Technology

A New Collaborative Approach to Defectivity Challenges in the Automotive Industry

Wenge Yang

Entegris

Automotive Computer Redundancy - Transition from Passive to Active Fail Safe

Minatake Kashio

Fomalhaut Techno Solutions