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Path to Co-Packaged Photonic I/O for Large-Scale Chip-to-Chip Interconnect

This presentation discusses the trends driving the need for co-packaged photonic I/O ports for large scale chip-to-chip interconnect and the corresponding requirements to enable scale deployment. Specifically, we will discuss challenges and solutions in the areas of photonics and advanced packaging technologies, in context of key applications.

Thomas Liljeberg

Thomas Liljeberg

GM Photonic Integration, Silicon Photonics Product Division, Intel