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Leveraging the Benefits of Co-Packaged Silicon Photonics to Meet Future Data Center/HPC Needs

In recent years, we’ve seen tremendous progress in the novel devices, business impact from commercialization efforts of photonics, and advanced hardware requirements for cloud and exascale computing. This talk will address some of the recent progress as they apply to silicon photonics foundry process development, packaging and assembly requirements to enable commercially-viable co-packaged silicon photonics. 

Seyedi Ashkan

Seyedi Ashkan

Senior Research Scientist, Hewlett Packard Labs