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Enabling SiPh Packaging Features to Unleash Next Gen C2C Solutions in a Wild West World

As we work with customers to explore the use of GF's SiPh technologies for next gen data-center applications, it is clear that a transition in packaging is needed to enable more cost-effective, advanced packaging solutions. We have developed the first generation of these SiPh packaging features to enable a shift from past niche wild west ecosystems toward high volume manufacturing packaging solutions needed for the industry going forward.   This presentation will describe these existing features in our Monolithic SiPh foundry offering and how our feature road-map will further enhance the evolution of this packaging ecosystem.

Dan Berger

Dan Berger

Senior Director of Advanced Silicon Packaging, GLOBALFOUNDRIES

Speaker