[Silicon Photonics] How and When State-of-the-Art Si-Photonics Will Replace Chip-to-Chip Interconnect in VLSI
Years ago, we used optocouplers to interface various boards or actuators. Today, we have transceivers capable of 100GbE to 400GbE and beyond; all in a small mechanical housing. With the increase of data flow for cloud computing and 5G, the industry is working to reduce cost, power, and enhance the capability of the high-speed transmission for short or long distances. The efficiency of the CMOS industry using silicon photonics leads to very small in package optical chiplets around the dice (using 3D structure, multi stacking, TSV). Therefore optical I/Os and digital logic are converging to offer disruptive architecture for chips but also for system level. In this workshop, we explore state-of-the-art of Silicon Photonics and look to the future with a debate to understand "When will silicon photonics supplant copper interfaces for VLSI and beyond for datatcom?"