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[LIVE] Continued Applications Innovation Through Heterogeneous Integration

Tuesday, July 21 | 12:30 pm - 2:00 pm


As microelectronics continue to become more pervasive across all aspects of life and industry – from data centers to mobile communications to medical and healthcare – the drive for improvements in PPAC (Power, Performance, Area, Cost) continues as strong as ever. As geometric scaling continues to test the limits, Heterogeneous Integration has come to the forefront as a fundamental path forward for not only innovation of new devices and systems, but also continuous improvements in PPAC. This year’s session will dig into 4 application areas – High-Performance Computing (HPC), 5G, Aerospace & Defense, and Medical/Health – and the integration technologies that continue to support innovations in this area.


Heterogeneous Integration for HPC, Data Centers & Advanced Packaging

Dale Becker


Ravi Mahajan


William Chen

ASE Group
12:30 pm - 1:00 pm

Heterogeneous Integration for Future Communications & Aerospace & Defense

Tim Lee


Jeff Demmin


William Chen

ASE Group
1:00 pm - 1:30 pm

Heterogeneous Integration for Medical/Health & SiP/Module

Mark Policks

Binghamton University

Klaus Pressel

Infineon Technologies AG

William Chen

ASE Group
1:30 pm - 2:00 pm