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[LIVE] Advanced Manufacturing Processes for a Changing Industry

Wednesday, July 22 | 9:00 am - 11:30 am

The semiconductor industry has not been in a straight scaling line for some time. That said, the challenges it faces are daunting as EUVL is inserted more and more into production, and advanced structures flesh out nodes below 5nm. As the industry pushes ahead with advanced structures to continue scaling to 2nm (logic) and below 1znm (DRAM), there will be a need for partnerships to define and speed innovation. This session gathers experts in the major manufacturing processes and supporting areas needed to advance the industry below 5nm.

 

More Advanced Manufacturing Processes for a Changing Industry Sessions

Agenda

Update on EUV Lithography: Enabling 2nm and Beyond

Michael Lercel

ASML
9:00 am - 9:30 am

Advanced Interconnect Scaling: Cu Damascene Extendibility - How Far Can We Go?

Chris Penny

IBM Research
9:30 am - 10:00 am

Scaling DRAM Beyond 1znm

Thy Tran

Micron Technology
10:30 am - 11:00 am

Fabrication, Measurement, Modeling of Devices: From a Few Nanometers to Single Atom Regime

Richard Silver

NIST
11:00 am - 11:30 am