Multi-chip Package Interconnect Scaling to Achieve Quasi-monolithic Performance

TechTALKS Stage North Thursday, July 11
2:50pm to 3:15pm

Heterogeneous integration is clearly providing new product opportunities with the ability to mix and match nodes for the best function.  One of the key goals is to integrate the mixed node die such that nearly monolithic performance can be achieved.  This requires dimensional scaling of the die to die interconnects as well as novel integration within the multi-chip package.  Advances in scaling which impacts vertical interconnect density (IO/mm^2), lateral interconnect density (IO/mm/layer), as well as novel stacking to optimize performance (energy/bit) and power delivery, will be discussed.

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