There is a great sense of urgency in preparing the supply chain to enable HVM at advanced nodes. Industry standards on how defects are measured on various components and sub-components and on how these results are reported are severely lacking. This is especially alarming when several yield excursions are linked to a wide range of component- and subcomponent-induced defectivity. Furthermore, current component and subcomponent defect traceability lack the rigor for advanced technologies, particularly with regard to detectability, sensitivity, and methodology. In this session, efforts on baseline measurements for critical components, developed under the SEMI Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community, will be presented. This session will also provide some case studies on how these methods influence component selection utlimately reducing defectivity during manufacturing.