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Standards Based Traceability to meet Reliability and Security Challenges

Smart Manufacturing Pavilion Thursday, July 11
11:30am to 12:00pm

It is normal practice to include an electronic ID on the primary chip in an application.  However, this only allows you to track back to the wafer XY.  It does not provide any visibility into the other die and consumables in the package, or the assembly processes used to assemble the package.  This presentation will describe how the SEMI standards E142, T23 and new counterfeit prevention standard under development, offer a framework for low cost, secure and comprehensive traceability through the supply chain and within each node of the supply chain.

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