Current architectures using 2D packaging and interposer-based solutions may not be sufficient for future high-performance, high-data-bandwidth applications like Artifical Intelligence. A variety of new ideas like monolithic or nre-monolithic 3D, in-memory processing, neuromorphic and quantum architectures are being studied. This session presents some of these exciting ideas. 2.5D is today’s best solution, but a “true 3D” system combining logic and memory may be needed for the next quantum leap of performance, particularly for future IoT/AI applications.
TechTALK: New Architectures to Enable the Intelligent Future
TechTALKS Stage South Wednesday, July 10 10:30am to 12:40pm
Do you want to attend this session? Register for SEMICON West.
Senior Fellow, Process R&D
Jeff Burns, PhD
Director, AI Compute