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2019 Programs Catalog

2019 Programs Catalog

TechTALKS TechTALKS Stage South Tuesday, July 09
10:30am to 12:30pm

To take full advantage of Industry smart manufacturing capabilities, organizations must holistically evaluate their Digital Architecture - from intelligent edge computing to the entire supply chain. It is critical that organizations have a scalable, flexible and secure infrastructure to enable cross-organizational collaboration. With this approach, the successes of smart facilities are leveraged into the successes of a smart organization as a whole.

 

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Victor Peng
President and CEO
Xilinx
Cliff Young, PhD
Engineer
Google
Jeff Bier
Founder l Embedded Vision Alliance
President, BDTI
PR (Chidi) Chidambaram, PhD
VP of Process Technology and Foundry Engineering
Qualcomm
Keynotes & Executive Panels Blue Shield of California Theater at YBCA Tuesday, July 09
9:15am to 4:30pm

In Partnership with: 

                

AI Design Forum Agenda

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Don Clark
Freelance Contributor
New York Times
Amanda Scarnati, Esq.
Equity Research Analyst
Citi Research
John Pitzer
Managing Director
Credit Suisse
CJ Muse
Sr. Managing Director, and Sr. Equity Research Analyst
Evercore
Tammy Kiely
Partner and Managing Director, Technology Investment Banking
Goldman Sachs
Mitch Steves
Equity Research Analyst
RBC Capital Markets
Keynotes & Executive Panels Blue Shield of California Theater at YBCA Tuesday, July 09
2:30pm to 3:30pm

Analysts see powerful new semi demand drivers spurring higher unit growth, rising capital intensity driving higher equipment spending, and profit-minded capital investing enabling healthier industry dynamics.  All of this is very positive, and the consensus is that the current memory cycle will find a bottom in 2019, with growth resuming in 2020. However, the bull market is already longer than most and tariff and trade uncertainties could impact semi and equipment shipments directly or indirectly by derailing the global economy.  Join us at this year's Bulls & Bears to hear Wall Street experts discuss whether short term pain will lead to long term gain.

Moderator: Don Clark, Freelance Contributor, New York Times

Panelists:

  • Amanda Scarnati, Equity Research Analyst, Citi Research
  • John Pitzer, Managing Director, Credit Suisse
  • CJ Muse, Senior Managing Director and Senior Equity Research Analyst, Evercore ISI
  • Tammy Kiely, Partner / Managing Director, Technology Investment Banking, Goldman Sachs
  • Mitch Steves, Equity Research Analyst, RBC Capital Markets
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Smart Design Pavilion Smart Design Pavilion Thursday, July 11
1:30pm to 3:35pm

From DSP and media processing through changing interface standards, SoCs continue to increase in complexity. This session will explore tools and methodologies to develop these complex chips, along with advanced verification methodologies to assure correctness.

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Smart Design Pavilion Smart Design Pavilion Tuesday, July 09
1:30pm to 4:30pm
Smart Design Pavilion Smart Design Pavilion Wednesday, July 10
1:30pm to 4:05pm

Machine Learning, AI, and EDA: From EDA tools to voice and image recognition, machine learning and AI are increasingly important for both the design and the design process. This session will explore the impact on applications and tools.

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Smart Design Pavilion Smart Design Pavilion Tuesday, July 09
10:30am to 12:30pm

As we reach the limits of scaling geometries, this session will explore new ways to continue to increase system functionality while reducing cost and size.​

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Smart Design Pavilion Smart Design Pavilion Thursday, July 11
10:30am to 12:30pm

With SoCs increasingly used in critical applications, and more of the system software being integrated onto those chips, hardware and software security becomes increasingly critical for designers. Speakers will discuss security concerns and risks in today’s designs.
 

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Smart Design Pavilion Smart Design Pavilion Wednesday, July 10
10:30am to 12:30pm

Silicon Design in the Cloud: As costs both for owning the tools and the networking infrastructure used for designing (including verification and modeling) of silicon dramatically increase, companies are increasingly looking for cloud-based solutions on which to do their silicon design. This session will chart the current and future of such cloud- based design from the perspective of silicon design tool users, developers of such tools, and cloud solution providers.

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W Hotel, San Francisco Tuesday, July 09 5:00pm

 New Paradigms in Microelectronics–Providing R&D for the 21st Century

CEA-Leti and the Fraunhofer Group for Microelectronics with the Research Fab Microelectronics Germany (FMD) invite you to the Workshop "New Paradigms in Microelectronics–Providing Research and Development for the 21st Century" at the W hotel, San Francisco, on July 9th 2019 at 5 p.m. during Semicon West

Join us to discuss the new visions, directions and paradigms for 21st Century Microelectronics. Experts from both organizations will present the newest trends and first results in next generation neuromorphic computing, quantum technologies and microelectronic device technologies. The workshop will conclude with a reception and ample opportunities for discussion and networking with the teams.

For more information, please contact: didier.louis@cea.fr 

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Moscone South, Lower Level, Room 8 Tuesday, July 09
8:30am to 4:30pm
Grand Hyatt San Francisco Monday, July 08
10:00am to 5:05pm

ITF USA SEMICONDUCTORS FOR HEALTH (morning) and ITF USA SCALING (afternoon)

LEAP INTO THE SEMICONDUCTOR FUTURE

Semiconductor technologies and system innovations are absolutely vital for our data-driven society. They enable powerful solutions to compute, store and connect the massive amounts of data which are generated every day. In healthcare specifically, semiconductors are a key driver fur much-needed innovations to tackle current and future challenges. They enable solutions for more personalized therapies and personalized healthcare in general.

imec Technology Forum USA presents a half-day afternoon event, July 8 on Scaling and adds a morning event focused on Semiconductors for Health.

LEARN MORE

 

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Shaheen Dayal
Vice President
Intel Corporation
Mary Champagne
Senior Purchasing Manager
TEL US
Holly Lind
Area Vice President
World Wide Technology
Rupert Perera, PhD
President
EUV Tech
Smart Workforce Pavilion Smart Workforce Pavilion Thursday, July 11
10:30am to 11:30am

Our industry’s future success is dependent on innovation, diversity and inclusion of the best ideas in the world. Panelists from various categories comprising suppliers and customers will discuss key challenges they encountered, success stories, and ideas for how each company can increase ownership diversity across the semiconductor industry. Join us to understand and increase Diversity in the Semiconductor Industry. 

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Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
9:35am to 10:05am

As the pace of change accelerates, the future is arriving faster than ever before. Information technology is the engine of this change and will continue to drive new opportunities for innovation at every level -- from materials to devices to systems -- in the decades to come. While bits and their underlying mathematics have been the foundation of digital systems for half a century, emerging workloads and computing challenges require new approaches in the decades to come.

Infusing computer science with neuroscience, AI has already achieved superhuman accuracy in narrow classification tasks by learning from labelled data. In the future, AI will broaden to better intuit context, time and predictive insights directly from the physical world. And new kinds of hardware will be required to provide the neurons that drive these broad AI systems.

Combining physics and computer science, the emerging field of quantum computing draws on quantum bits or qubits. Quantum computing holds the potential to solve problems which even the most powerful classical computers cannot. From financial systems optimization to chemical simulations, qubits will gain clear advantages over bits in the future.

The future of computing will look fundamentally different than it has in the past. Computing engines will be fueled by bits, neurons and qubits, working in concert through a secure, hybrid cloud with intelligent, automated programming. Find out how and when we might get there.

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Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
10:20am to 10:50am

In addition to discussing the future of biofabrication and how it impacts the semiconductor industry, Dean Kamen will talk about opportunities to create the future workforce.  How we can build the next generation of ‘computers’—not the hardware, but the future professionals who will continue to develop our technologies and use them.

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Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
10:50am to 11:20am

Semiconductor fabs have historically used inspection and metrology equipment for yield learning – to monitor individual process tools for excursions and to assure that their manufacturing processes stay in control to maximize productivity. The increasing semiconductor content in automobiles, driven by growth in ADAS, electrification and autonomy, has put a growing focus on the quality and reliability of these devices and their implications for consumer safety and satisfaction.

This push for better reliability is embodied in the industry’s Zero Defect initiative, as car manufacturers drive semiconductor DPPM requirements for their chip suppliers below 1PPM. More than half of the semiconductor failures that occur on the automotive assembly line today (so-called 0km failures) have their origin in semiconductor fab defectivity. To successfully meet their customers’ reliability goals, fabs across the full range of design rules and device types are looking at their inspection and metrology data in a fresh light. Not only are they using their process control tools to do a better job of reducing overall sources of defectivity, they are also looking to the data to help disposition individual die, removing high-risk defective die from the supply chain.

In this keynote, KLA will update some of these industry trends and some of the exciting steps forward in quality and reliability made possible by these novel methods.

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Keynotes & Executive Panels Wednesday, July 10
11:20am to 11:50am

As we migrate to Industry 4.0 where we anticipate the next wave of industrial transformations to be led by innovation in autonomous approaches, we have to ask ourselves “What does innovation look like”? To achieve our key [semiconductor] industry metrics of scaling Power, Performance, Area, and Cost (PPAC), it is critical to leverage emerging approaches to data collection, analysis, and modeling, to enable intelligent automation and control. At the same time, as we migrate towards 3D devices, the complexity is increasing to levels that are slowing down time-to-market and increasing costs to unacceptable levels.

 

From early stages of research and development, through initial yield ramps, and finally to maintaining highly efficient factories during HVM, the common thread is leveraging emerging technology in sensors, big data analytics, computational analysis, virtual models, and intelligent automation to achieve the quickest and most cost efficient path during each of these phases.

As we pursue PPAC scaling, process variability and increasingly stochastic effects, constrain circuit design, preventing us from reaching our targets. An increasing focus on Design-Technology Co-Optimization (DTCO) requires more advanced tools to help us better predict areas we need to reduce variability. At the same time, once a solution path has been identified we need to be able to predict and manage this variability across fleets of tool in a high volume manufacturing environment.

To realize Industry 4.0 we need new tools and most importantly new skillsets in our workforce. Standardization of critical measurement techniques in patterning, ensuring data quality, and data security are just a few of the challenges that we face.

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Bob Pearson
Author, Senior Advisor at W2O Group
Adjunct Professor, McCombs School of Business at the University of Texas at Austin and Syracuse University
Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
9:05am to 9:35am
Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Tuesday, July 09
1:30pm to 4:30pm

Assess the current guidelines, and activities that are being worked on including recent Standards and best know methods. Also discuss the status of implementation of smart manufacturing technolgies across the wafer processing, packaging, assembly & test, SMT, PCBA and EMS. This will set the stage for the rest of the sessions at sessions at the Smart Manufacturing Pavilion.

Session Moderator

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Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Tuesday, July 09
10:30am to 12:30pm

Data scientist and professionals will get the opportunity to interact with students through an interactive panel bar and activity. Students will also get a chance to network and connect with professionals exhibiting in the Smart Manufacturing Pavilion and participate in an activity with the professional panel.

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Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Wednesday, July 10
10:30am to 12:30pm

New data transfer and communications such as 5G are being used to increase smart manufacturing processes.  However, these new protocols have opened up new security concerns in the fab.  Discussions will focus on taking advantage of these new technologies while protecting data and information that can impact fab production.

Session Moderator: Ranjan Chatterjee, VP & GM, Smart Factory Solutions, Cimetrix

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John Behnke
Inficion/FPS
Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Thursday, July 11
10:30am to 12:30pm

Packaging, Assembly and Test facilities are rapidly automating and quickly coming up the learning curve with smart manufacturing implementations. This session will discuss the technologies that are currently in use and what is planned for the futre to improve the processes in this segment of the industry.

Moderator:

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Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Thursday, July 11
1:30pm to 3:30pm

Smart manufacturing is improving the processes on the fab floor and this session will focus on how we can use the same technology to improve overall efficiencies from across the electronic manufacturing supply chain. Experts from our industry will discuss the benefits of using smart technology to improve supply chain logistics. Also potentially hear from other industries who will provide studies of how this technology is currently being put into use.

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Brian Coppa
Principal Applications Engineer
EMD Performance Materials
Smart Manufacturing Pavilion Smart Manufacturing Pavilion, South Hall Wednesday, July 10
1:30pm to 4:30pm

Hear how by connecting fab data analytics, equipment, and material inputs process efficiencies and yield enhancement are realized; and how predictive maintenance, fault detection, and digital twins now impact fab operations. Discussions will also address how the increase of digitization, machine learning, virtual metrology and connectivity in the fab are improving automation and cycle times.

Session Moderator: Brian Coppa, Principal Applications Engineer, EMD Performance Materials

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Smart MedTech Pavilion Smart MedTech Pavilion, North Hall Wednesday, July 10
1:30pm to 4:30pm

As medical technology devices become wireless and more compact, sophisticated manufacturing techniques similar to those employed in the microelectronics industry are emerging. Medical devices with the compact, high performance design of top-end consumer wearables, but with extraordinary reliability and clinical accuracy are emerging. This session will showcase new capabilities in the manufacturing arena for clinical tools, tele-med devices, and sensors that promise an advanced and robust supply chain for the medical device market. 

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Smart MedTech Pavilion Smart MedTech Pavilion, North Hall Tuesday, July 09
10:30am to 12:30pm

From silicon-based MEMS to additive manufacturing processes for flexible electronics, production tools with high throughput and reliability are essential for robust device and system manufacturing. These manufacturing processes utilize breakthrough new materials (printed organics, nanomaterials, and ultra-thin wafer technology) and require integration of semiconductor fabrication with biochemical functionalization, creating both new challenges and opportunities for tool makers.   This session will showcase advanced materials in the Smart MedTech supply chain and advanced processing equipment for Smart MedTech device manufacturing.

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Smart MedTech Pavilion Smart MedTech Pavilion, North Hall Tuesday, July 09
1:30pm to 4:30pm

The internet of everything has moved beyond consumer electronics (gaming, smart home) and autonomous transportation into healthcare.  Medicine has become decentralized, personalized, and outcome based. Never has healthcare been more customer-centric and or the medical community more connected; sensors, wireless connectivity, robust mobile operation and the use of intelligent systems to store, secure, and analyze huge amounts of data are expanding the medical technology ecosystem.  Nascent applications include telemedicine, remote monitoring of cognitive health and treatment response, daily wellness, athletic performance, and early-stage disease detection. These application spaces employ wearable biochemical sensing devices, point-of-care diagnostics, and emergency medical techniques that improve the efficacy of medical professionals across the spectrum of care. This session will explore some of these innovative applications, the sensors, and devices that enable them, and how their integration will change the way we experience healthcare in the future.

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Smart MedTech Pavilion Smart MedTech Pavilion, North Hall Wednesday, July 10
10:30am to 12:30pm

Integration of the elements of a smart sensor system and the management of power efficiency and signal-to-noise presents unique challenges in the Smart MedTech market. Contextual awareness in biochemical systems utilizing a multiplicity of sensors is necessary. And the human-to-machine interface often strays from the conventional audio or display. This session will showcase advancements and unique system considerations for Smart MedTech.

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Smart MedTech Pavilion Smart MedTech Pavilion, North Hall Thursday, July 11
10:30am to 1:00pm

Smart MedTech is the most interdisciplinary vertical in the electronics supply chain. New system architectures will require sensors, advanced biochemistry, proprietary algorithms, and clinical data science in a regulated, cost-sensitive manufacturing environment.  In this session, a diverse set of innovators - academics, entrepreneurs, and research institute leaders - showcase their contributions to this nascent field and their vision for the next decade.

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Omkaram (Om) Nalamasu, PhD
Sr. Vice President, Chief Technology Officer
Applied Materials
Tiernan Ray
Freelance Journalist
Shahin Farshchi, PhD
Partner
Lux Capital
Laura Oliphant, PhD
General Partner
Spirit Ventures
Aymerik Renard
General Partner
Hardware Club
Rajesh Swaminathan
Senior Investment Director, General Manager
Applied Ventures
Trina Van Pelt
Vice President & Senior Managing Director
Intel Capital
Keynotes & Executive Panels Blue Shield of California Theater at YBCA Tuesday, July 09
3:30pm to 4:45pm

Co-presented by:                  

Innovations driven by semiconductors are enabling growth across multiple inflections - AI, AR/ VR, Autonomous Vehicles, Industrial IoT, Robotics, Healthcare etc. Our panel of leading VCs (strategic and financial) and a hardware accelerator will discuss how and where they are investing in these semiconductor-driven inflections. We will discuss the opportunities and challenges for entrepreneurs pursuing these deeptech-driven market inflections. We will discuss whether the opportunities are in trailing edge or leading edge nodes. The panelists will also share the best practices for building successful startups. 

Opening: Om Nalamasu, PhD, Sr. Vice President, Chief Technology Officer, Applied Materials, Inc. and President, Applied Ventures

Moderator: Tiernan Ray, Freelance Journalist
Panelists:

  • Shahin Farshchi, PhD, Managing Partner, Lux Capital

  • Laura Oliphant, PhD, General Partner, Spirit Ventures

  • Aymerik Renard, General Partner, Hardware Club

  • Rajesh Swaminathan, General Manager, Applied Ventures

  • Trina Van Pelt, VP, Senior Managing Director, Intel Capital

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Jessica Gomez
Founder and CEO
Rogue Valley Microdevices
Elizabeth Lee
Principal Engineer, Yield Enhancement and Process Integration
X-Fab
Katie Maloney
Business Line Manager
Edwards
Christine Pelissier
General Manager, OEM North America
Edwards
Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
1:30pm to 2:30pm

The Spotlight on SEMI Women program recognizes and celebrates the many accomplished women who work in our global microelectronics industry.  This panel features the women who have been honored through the Spotlight program to date:

  • Jessica Gomez, Rogue Valley Microdevices 
  • Elizabeth Lee, X-FAB 
  • Katie Maloney, Edwards

Moderated by Christine Pelissier, Edwards, the panel will address leadership, mentoring and the responsibility to inspire and be a role model to others. 

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Keynotes & Executive Panels Blue Shield of California Theater at YBCA Wednesday, July 10
10:05am to 10:20am

Each year, SEMI publicly recognizes and honors technological and industrial leadership through the SEMI Award North America program. 

The awards program was established in 1979 to recognize enabling technical contributions by individuals and teams to the microelectronics industry. The enabling technological contributions to the microelectronics industry can be as broad as Integrated Circuit Design, Design for Manufacturability (DFM), new mask manufacturing methods, new device manufacturing architecture and methods and the assembly and test of integrated circuits and microelectromechanical (MEMS) devices.

In 2009, SEMI announced its first significant change by expanding criteria to include outstanding achievements in developing new and emerging technologies expected to have significant future value to the semiconductor industry. This change in criteria broadens the scope of the SEMI Award to recognize technology developments including semiconductors, photovoltaic solar displays and solid state lighting.

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Moscone Center South Monday, July 08
9:00am to 5:00pm

SEMI EHS Division: https://www.semi.org/en/environment-health-safety

Please contact Olivier Corvez, Senior Manager, Global EHS & Advocacy, for additional information at ocorvez@semi.org

 

EHS Division Working Group - TBD 
Monday, July 8 | 9:00-10:20am

EHS Division COHE Advocacy Working Group
Monday, July 8 | 10:30-12:00 noon

Joint JP/NA ICRC Meeting
Monday, July 8 | 1:30-5:00pm

 

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INTERACT, ENGAGE & LEARN

The Smart MedTech Pavilion features exhibits from materials providers, device manufacturers, and system integrators. Subject matter experts will share their insight into early adoption trends, marketing forecasts, and the electronic transformation of healthcare.

Companies in the electronics supply chain and product developers in medical technology to showcase their expertise and products within this rapidly changing and growing field. From components, devices, and communications to machine learning, diagnostics, and IT systems, semiconductor electronics play a vital role in enabling new applications and health care solutions. MEMS and sensors are playing an increasingly important role as we move rapidly towards personal and at-home patient care. So too are flexible and printed electronic solutions for small form-factors, lightweight and unobtrusive mobile applications. Innovation and commercial deployment of these technologies in recent years are providing the tipping point now for the realization of smart medical devices and services that will revolutionize healthcare.

Hear Experts in the Meet the Experts Theater at the Smart MedTech Pavilion

The Smart MedTech Pavilion will foster collaboration in the manufacturing ecosystem including materials, equipment, services, and devices, especially the sensors and sensor systems. Hear about new, and innovative products and see application demos. 

         

 

          

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Receptions, Standards Moscone Center South Tuesday, July 09
6:00pm to 7:30pm

Join your colleagues at a special Awards & Networking event to Celebrate the 1000th Standard!

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Standards Moscone Center South Monday, July 08
8:00am to 9:00pm

Automated Test Equipment. Gases. Silicon Wafer. Information & Control. Liquid Chemicals. Facilities. Regional Standards Committee. 

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Standards Moscone Center South Tuesday, July 09
9:00am to 7:30pm

Information & Control. Liquid Chemicals. Environmental Health & Safety. Facilities & Gases. Metrics. Physical Interface & Carriers. Silicon Wafer. Other Committees. 

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Standards Moscone Center South Wednesday, July 10
7:00am to 6:30pm

Environmental Health & Safety. Information & Control. MEMS. Metrics. Microlithography. Photovoltaic. Physical Interfaces and Carriers. Traceability. Other Committees. 

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Standards Moscone Center South Thursday, July 11
8:30am to 6:00pm

3D Packaging and Integration. Environmental Health & Safety. Traceability. Other Committees. 

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TechTALKS TechTALKS Stage North Thursday, July 11
10:30am to 12:40pm

With one IC manufacturer having announced it will delay using EUVL until 2021, and another major foundry pivoting away from 7nm, it seems reasonable to take a closer look at the state of advanced lithography and how recent news could impact deployment of different choices as the industry proceeds to 5nm, 3nm, and beyond. Included in the discussion will be the economics issues from a market standpoint. Also of interest is how well the industry can tackle stochastic barriers and address metrology, resist, and mask infrastructure challenges as EUVL is deployed. In the meantime, the industry will continue to need 193i extensions — probably well into 5nm

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TechTALKS TechTALKS Stage North Wednesday, July 10
10:30am to 12:30pm

Co-hosted by the Electronic Packaging Society (EPS) of IEEE and the SEMI Americas Advanced Packaging Committee 

The electronics industry is serving humanity in unprecedented ways, creating lifestyle, healthcare, transportation, and industrial efficiencies on a global scale. This pattern is not only set to continue, but to dramatically expand through the ascent of artificial intelligence across countless applications, and subsequent migration of big data and data analytics to the cloud. As such, the value-capture in the microelectronics industry is rapidly shifting from Moore’s Law Scaling to Heterogeneous Integration -  chiplets and SiP through Advanced Packaging focusing on systems and market applications. But, how will AI, Cloud and other emerging applications drive innovation in technology and system integration? And how will technology advancements bring about further disruptions in the market?  This session will address these burning questions and shed some light on how our ecosystem must evolve to navigate this vast disruptive market landscape, from high performance computing & data centers, autonomous driving, consumer mobility & 5G with particular focus on system hardware integration and products of the future.

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TechTALKS TechTALKS Stage South Tuesday, July 09
2:00pm to 4:00pm

As we reach the limits of scaling geometries, this session will explore new ways to continue to increase system functionality while reducing cost and size.

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TechTALKS TechTALKS Stage North Tuesday, July 09
10:30am to 12:30pm

There is a great sense of urgency in preparing the supply chain to enable HVM at advanced nodes. Industry standards on how defects are measured on various components and sub-components and on how these results are reported are severely lacking. This is especially alarming when several yield excursions are linked to a wide range of component- and subcomponent-induced defectivity. Furthermore, current component and subcomponent defect traceability lack the rigor for advanced technologies, particularly with regard to detectability, sensitivity, and methodology. This session will highlight the need for standard quality assurance measurements for critical equipment parts, subsystems and consummables.  Thought leaders will share perspectives on critical areas where the supply chain stakeholders can collectively collaborate to address these quality assurance gaps.

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TechTALKS TechTALKS Stage South Thursday, July 11
1:30pm to 3:35pm

Co-presented by: SEMI, UC Santa Cruz and CITRIS & the Banatao Institute

Since the launch of the commercial video game industry in the 1970’s, hardware and gaming have been inextricably linked. From driving the latest in processing and rendering capabilities to impacting the interactivity of a game through the design of its controllers, hardware and games have had a synergistic relationship that continually pushes each other’s boundaries. In this session, we explore key emerging areas within games—such as AI, VR, and wearables—that both expand the application of hardware to different (and often unexpected) contexts such as healthcare & training; and push its current capabilities.

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Yianni Gamvros
Head of Business Development
QC Ware
TechTALKS TechTALKS Stage South Wednesday, July 10
2:00pm to 4:05pm

Session Partner: Quantum Economic Development Consortium (QED-C)
We are entering a new era of technology development for computing, communications, networking and sensing: the quantum era. Leading companies in the semiconductor and information technology space are mobilizing to find ways to harness quantum mechanical phenomena to accelerate computing, communicate more securely, and enable vastly improved navigational and locational services. Realizing this vision—and the huge market opportunities that are on the horizon— requires the coordination of the entire quantum "technology stack". In this session, you will hear from the Quantum Economic Development Consortium (QED-C), which is the group led by SRI International that brings industry from across the supply chain together to address enabling technology, standards and metrics, and workforce needs and will guide the US government's investment priorities in quantum technology R&D. You will also hear from industry leaders in the rapidly emerging quantum technology industry.

Moderator: Yianni Gamvros, Head of Business Development, QC Ware 

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TechTALKS TechTALKS Stage North Wednesday, July 10
2:00pm to 4:30pm

Our morning session focused on the disruptive electronics system landscape, and we will shift gears slightly for our afternoon session. While continuing the theme of AI at the Gate & Cloud at the Edge, this session will take a closer look at technology innovation and collaboration efforts for System in Package (SiP) through Heterogeneous Integration. Consideration will be given our broad ecosystem from design to manufacturing and materials to equipment, with speakers poised to articulate the innovation and collaboration efforts envisioned to respond to the disruptive market and to realize critical value capture for the systems and products of the future.

There are many emerging technologies considered as potential, cost-effective system integration options, such as fan-out/fan-in, wafer-level, panel-level, embedded substrates, active & passive interposers, silicon bridge, chiplets, and more. This session is designed to bring together experts from different parts of the electronics ecosystem for dialogue and debate on the best possible directions for the future.

 

 

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TechTALKS TechTALKS Stage North Tuesday, July 09
2:00pm to 4:00pm

With the increasing complexity of IC architecture, and the continuing evolution towards the need to control each circuit component down to the molecular level, it is becoming essential to define new and/or updated ways to detect, measure and eliminate sources of contamination, ultimately reducing risks and costs for IDM’s. Key topics will include role of particles, impurities and associated analysis, as well as a panel session, allowing attendees to provide direct inquires on all topics.

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TechTALKS TechTALKS Stage South Thursday, July 11
10:30am to 12:40pm

There is no doubt that MEMS and sensors are at the leading edge of double-digit growth in multiple consumer and commercial applications. They are the source of much of the buzz around Artificial Intelligence and Machine Learning. But what is happening in the design and manufacturing of these devices to keep pace with the industry demand for more innovation, higher integration and volume, lower power and cost, smaller footprints and faster design cycles? Can this backbone of the supply chain keep pace with the market demand in the next decade? This session will tell us why the answer is yes and how.

 

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TechTALKS TechTALKS Stage South Wednesday, July 10
10:30am to 12:40pm

Current architectures using 2D packaging and interposer-based solutions may not be sufficient for future high-performance, high-data-bandwidth applications like Artifical Intelligence.  A variety of new ideas like monolithic or nre-monolithic 3D, in-memory processing, neuromorphic and quantum architectures are being studied.  This session presents some of these exciting ideas. 2.5D is today’s best solution, but a “true 3D” system combining logic and memory may be needed for the next quantum leap of performance, particularly for future IoT/AI applications.

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TechTALKS TechTALKS Stage North Thursday, July 11
1:30pm to 3:40pm

While the industry continues the work necessary to scale down to 5nm and 3nm in the more traditional ways, there is also significant work being done on the kinds of “scaling” technologies that are needed to move forward, such as 3D ICs. Different chip makers will use whichever methodology matches their customers’ needs and makes economic sense. This session takes a look at the various ways the industry is getting more out of traditional, and not so traditional, scaling. Also covered will be some of the more exotic architectures that could very will be used as the industry goes from 5nm to 3nm, and beyond.

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Mike Slessor
Chief Executive Officer
FormFactor
Janet Olson
Vice President, Research & Development
Cadence
Moscone North, Room 21 Wednesday, July 10
9:00am to 5:00pm

TEST VISION SYMPOSIUM —TVS 2019

July 10-11
Conference 9:00am – 3:40pm
Reception for TVS attendees 3:40–5:00pm
Moscone North, Room 21

SEE THE AGENDA

Test Vision is today's premier 2-day workshop for semiconductor and system test experts, organized with a vision towards the future of test to discuss coming trends, innovations and requirements. It is a highly-anticipated gathering of providers and users of test IP and equipment, all converging to hear and engage with leaders in the field. The conference typically has 100+ participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience. This year’s theme is “Ground Breaking Innovations in Test”

The growth in autonomous driving and the connected “everything” is driving the demand for semiconductors. This trend is putting more pressure on test costs as a result of higher coverage requirements or lower average selling prices. Test must become even smarter to address the increased quality demands, while at the same time remaining economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher performance analog, and increasing RF complexity. To address those challenges, all the tools in the arsenal must be brought to bear; increasing test instrumentation integration, smarter test strategies, self-test, adaptive test, system level test, and more sophisticated test hardware.

 

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John Kibarian
CEO, President, Co-founder
PDF Solutions
Moscone North, Room 21 Thursday, July 11
9:00am to 3:30pm

TEST VISION SYMPOSIUM

July 10–11, 2019
9:00am – 3:30pm
Moscone North, Room 21

SEE THE AGENDA

Test Vision is today's premier 2-day workshop for semiconductor and system test experts, organized with a vision towards the future of test to discuss coming trends, innovations and requirements. It is a highly-anticipated gathering of providers and users of test IP and equipment, all converging to hear and engage with leaders in the field. The conference typically has 100+ participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience. This year’s theme is “Ground Breaking Innovations in Test”

The growth in autonomous driving and the connected “everything” is driving the demand for semiconductors. This trend is putting more pressure on test costs as a result of higher coverage requirements or lower average selling prices. Test must become even smarter to address the increased quality demands, while at the same time remaining economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher performance analog, and increasing RF complexity. To address those challenges, all the tools in the arsenal must be brought to bear; increasing test instrumentation integration, smarter test strategies, self-test, adaptive test, system level test, and more sophisticated test hardware.

Test Vision Symposium Agenda

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Moscone South, Room 301 Wednesday, July 10
1:00pm to 4:30pm

IoT means many things to many people but everyone agrees it’s here and growing quickly.  IoT, including machine learning and movement to the edge, is fueling innovation as the high compute and ultra-low energy requirements are pushing technology to deliver on these needs.  The well-known characteristics defining IoT of “Sense”, “Compute”, and “Act” put additional burden on technology to full these requirements across a variety of use cases and environments without sacrificing reliability or quality.  All the various forms of SOI technology from Fully-Depleted SOI to High-Voltage to RF-SOI, are uniquely situated to deliver on the promise of today’s as well as tomorrow’s IoT roadmap.  The supply chain for all forms of SOI technology is in place.  This workshop will discuss the current and future solutions from a supply chain perspective.

SOI Industry Consortium

The SOI Industry Consortium is the leading industry organization representing the complete SOI-based microelectronics value chain. The SOI Industry Consortium is chartered with providing a strategic neutral platform for collaboration, thought-leadership, and education, where global executives interface and innovate with peers, partners, and customers to accelerate SOI industry growth. Among the activities of the SOI Industry Consortium, the association organizes industry-focused forums, workshops and training worldwide. Representing leaders from the entire electronics industry infrastructure, the SOI Industry Consortium’s current 33 members include Analog Bits, ANTAIOS, Applied Materials, Arm Limited, Cadence Design Systems, CEA-Leti, Coupling Wave Solutions, Dolphin Integration, GLOBALFOUNDRIES, Greenwaves Technologies,  IBM, IMEC, Incize, Intento, Invecas, NXP, Samsung, Shin-Etsu Handotai, Silicon Catalyst, Silvaco, Simgui, SIMIT, SITRI, Smarter Micro, Soitec, Stanford University, STMicroelectronics, Synopsys, VeriSilicon, UC Berkeley, Université Catholique de Louvain, University of Tokyo and Xpeedic. Membership is open to all companies and institutions throughout the electronics industry. For more information, please visit www.soiconsortium.org.

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Adrian Koh, PhD
Sr. Director, Automotive Business Development
Alpha & Omega Semiconductor
Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Wednesday, July 10
1:30pm to 4:35pm

At the forefront of autonomous vehicle and advanced driver assist system technology, sensors play the key role in providing the state of awareness in and around the vehicle. This session takes a look at the advancements of Automotive Sensors that enable the features of tomorrow’s innovation in an autonomous vehicle, user experience, and safety.

Moderator:
Adrian Koh, Sr. Director, Automotive Business Development, Alpha & Omega Semiconductor

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Anthony Le
Vice President Marketing
Macronix
Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Tuesday, July 09
1:30pm to 4:35pm

What technologies will be needed for Autonomous Driving Vehicles (ADV) to actually drive itself (level 4 & 5)?
Most experts believe this will not be achieved until after 2025. Come learn about ADV technologies from car makers, auto electronic OEM, and their supply chain.

Moderator:
Anthony Le, Vice President Marketing, Marconix

 

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Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Wednesday, July 10
10:30am to 12:35pm

As our society becomes more and more conscious of energy conservation and emission’s impact to the environment, automakers and electronics suppliers are following this trend closely ensuring that the right vehicles and relevant technologies are ready for exponential growth.  New and innovative ideas for vehicle electrification have surfaced recently from both established and new players in automotive.  Join us for a session discussing future trends in vehicle electrification.

 

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Anthony Le
Vice President Marketing
Macronix
Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Tuesday, July 09
10:30am to 12:40pm

How do you feel about Autonomous Driving Vehicles (ADV)?

Come hear at the Meet the Experts session

  • How governments and cities are regulating and testing the deployment of ADV

  • How ADV are regulated in California 

  • How Sensors will change Smart Cities/Smart Transportation

Moderator
Anthony Le, VP Marketing, Marconix

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Adrian Koh, PhD
Sr. Director, Automotive Business Development
Alpha & Omega Semiconductor
Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Thursday, July 11
10:30am to 12:40pm

5G will create a fabric of connected devices from the omnipresent smartphones, laptops, to city infrastructure, autonomous vehicles, and a myriad of other IoT devices.  The speed, scalability, and capacity from 5G will provide every industry and consumer with easy access to AI at the edge wirelessly and conveniently.  

Moderator: Adrian Koh, Sr. Director, Automotive Business Development, Alpha & Omega Semiconductor

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Adrian Koh, PhD
Sr. Director, Automotive Business Development
Alpha & Omega Semiconductor
Jonathan Wood
Sr Director, Next Generation and Standards Group, and GM Business Development for Advanced Technology for Strategic Programs
Intel
James Misener
Sr Director, Product Management, Global C-V2X Ecosystem Lead
Qualcomm
AJ Cooper
Head of Electrical Engineering, Uber, Jump
Uber
Frank Wilde
Vice President, Global Center of Excellence
SAP
Joshua Ness
Sr. Manager
Verizon 5G Labs
Smart Transportation Pavilion Smart Transportation Pavilion, South Hall Thursday, July 11
1:30pm to 3:00pm


5G will create a fabric of connected devices from the omnipresent smartphones, laptops, to city infrastructure, autonomous vehicles, and a myriad of other IoT devices.  The speed, scalability, and capacity from 5G will provide every industry and consumer with easy access to AI at the edge wirelessly and conveniently.  Join us for a panel discussion on the role 5G plays in smart transportation.

Moderator: Adrian Koh, PhD, Sr. Director, Automotive Business Development, Alpha & Omega Semiconductor


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Room 24 & 25, Moscone Center North Tuesday, July 09
10:00am to 4:45pm

The 34th edition of the globally established WT | Wearable Technologies Conference Series is THE must-attend event for all decision makers in the industry. The WT | Wearable Technologies Conference 2019 USA in San Francisco will guide you through the current status of the wearable market presenting a thrilling conference program, an extensive conference exhibition and networking opportunities with the Who’s Who of the entire WT ecosystem. Since 2006, WT | Wearable Technologies help you set your focus and give guidance for your business and strategy.

Visit the Expo (July 9 & 10 Only)

All attendees are welcome visit the Wearable Technologies exhibits in North Hall. 

Attend the Conference Sessions

SEMICON West and ES Design West attendees can purchase access to the Wearable Technologies Conference for $400 with an All In Pass. 

The Must Attend Event for the Wearable Tech Ecosystem!

Click here to learn more. 

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Room 24 & 25. Moscone Center North Wednesday, July 10
10:00am to 4:45pm

The 34th edition of the globally established WT | Wearable Technologies Conference Series is THE must-attend event for all decision makers in the industry. The WT | Wearable Technologies Conference 2019 USA in San Francisco will guide you through the current status of the wearable market presenting a thrilling conference program, an extensive conference exhibition and networking opportunities with the Who’s Who of the entire WT ecosystem. Since 2006, WT | Wearable Technologies help you set your focus and give guidance for your business and strategy.

Visit the Expo (July 9 & 10 Only)

All attendees are welcome visit the Wearable Technologies exhibits in North Hall. 

Attend the Conference Sessions

SEMICON West and ES Design West attendees can purchase access to the Wearable Technologies Conference for $400 with an All In Pass. 

The Must Attend Event for the Wearable Tech Ecosystem!

Click here to learn more.

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Receptions Moscone South, South Terrace, Level 3 Monday, July 08
6:00pm to 7:30pm

Kick off your SEMICON West and ES Design West experience at the Welcome Reception in the newly remodeled Moscone Center in San Francisco. Enjoy food and drinks while catching up with friends and meeting new colleagues and acquaintances. Also, join us in honoring the "Spotlight on SEMI Women" Award Winners:

  • Jessica Gomez, Rogue Valley Microdevices
  • Elizabeth Lee, X-FAB
  • Katie Maloney, Edwards
  • Ellie Yieh, Applied Materials
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Smart Workforce Pavilion Smart Workforce Pavilion Tuesday, July 09
10:30am to 12:30pm

The Smart Workforce Pavilion is where you’ll find the information you need to see where you fit in, and access the resources to get in the game and jumpstart your career. Come and network with industry professionals, discover career options and learn how you can contribute to the growth of an exciting industry.

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Smart Workforce Pavilion Smart Workforce Pavilion Tuesday, July 09
1:30pm to 4:30pm

How do you prepare for a 21st century workforce? Afternoon sessions focus on developing a diverse workforce, successful on-boarding programs, attracting and retaining the best talent, preparing for a career in microelectronics, and the best career paths for students and those just beginning in the industry.

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Smart Workforce Pavilion Smart Workforce Pavilion Wednesday, July 10
10:30am to 12:30pm

We know that mentoring is proven to improve talent recruitment, retention, engagement and promotion rates.  Depending upon which stage of career you're in - student, new employee or seasoned industry veteran, mentorship is a crucial component to career success. This session will discuss the key to finding the best mentor, what makes a good mentor, and how mentorship can be fulfilling to both men and women. Learn more about the benefits of mentoring, how to find or become a mentor, and ways to re-envision mentorship in the age of millennials.

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Smart Workforce Pavilion Smart Workforce Pavilion Wednesday, July 10
1:30pm to 4:30pm

Whether deciding on a future career, beginning your job search, or looking to make a change, these sessions will help you successfully communicate with current or future employers.

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Smart Workforce Pavilion Smart Workforce Pavilion Thursday, July 11
11:30am to 12:30pm

Our industry's future success is dependent on innovation, diversity and inclusion of the best ideas in the world. A more inclusive supply chain and diverse workforce is the focus of morning sessions.

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Smart Workforce Pavilion Smart Workforce Pavilion Thursday, July 11
1:30pm to 4:30pm

Microelectronics draws from diverse backgrounds, which is critical to success.  A strong network is key to advancing in your chosen field. It's even more important if you are a women. Sessions will discuss importance of teams, lessons learned, and the vital role of your network.

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