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AI DESIGN FORUM

AI DESIGN FORUM

AIDF IN PARTNERSHIP WITH

     
 

AI Design Forum™: The Future of Computing – from Materials to Systems

Tuesday of SEMICON West week features the AI Design Forum, a unique event that brings together industry leaders in semiconductor and system design and manufacturing who will share their vision for accelerating the AI Era of computing, from materials to systems.

Why? The Internet of Things, Big Data and Artificial Intelligence will transform the world’s major industries. But the computing architectures of the PC and smartphone eras cannot deliver the power and cost requirements of the tens of billions of smart sensors that will be incorporated into industrial and consumer products, creating the Internet of Things. Nor are they optimized for machine learning and inferencing applications in public and private cloud data centers.

Moreover, the industry is witnessing the slowing of Moore’s Law which no longer provides simultaneous improvements in performance, power, and cost. At the AI Design Forum, company leaders will outline a new playbook for innovation that can propel the industry into the next wave of growth.

KEYNOTES AND PRESENTATIONS

Introduction
Dave Anderson
President, SEMI Americas
A co-partner of AI Design Forum 2019 along with the Electronic Systems Design Alliance and Applied Materials.

Aart de Geus, PhD
Chairman and Co-CEO, Synopsys
De Geus co-founded Synopsys in 1986 and grew the company from a start-up in synthesis to an industry leader across silicon chip design, verification, IP integration, and security testing. He will share his vision of how the industry can collaborate and co-optimize in new ways to drive the AI roadmap, from silicon to software.

Lisa Su, PhD
President and CEO, AMD
AMD anticipated today’s 2D scaling issues and made significant investments in next-generation architectures and emerging techniques like heterogeneous design and advanced packaging to deliver the high-performance computing and graphics products that will power the AI Era.

Victor Peng
President and CEO, Xilinx
Peng is taking Xilinx beyond its heritage in programmable chips to entirely new silicon and software platforms for AI Era applications, from the edge to the cloud. While progress in conventional computing is slowing, Xilinx is driving architectural innovation across hardware and software to deliver order-of-magnitude improvements in performance and performance-per-watt. 

Gary Dickerson
President and CEO, Applied Materials
Dickerson built his 30-year leadership career immersed in manufacturing technologies spanning lithography at AT&T; process control at KLA; ion implantation at Varian Semiconductor; and materials engineering of all kinds at Applied Materials.  Dickerson will introduce new ways to accelerate industry innovation -- from materials to systems.

Cliff Young, PhD
Engineer, Google
Young is a hardware/software co-design expert who works on Google TPUs, domain-specific architectures that accelerate deep learning training and inference for applications including Search, Maps, Photos and Translate. Young will share the system demands of cloud and neural net workloads and discuss Google’s needs for the future of semiconductor design and manufacturing technology in the AI Era.

Jeff Bier
Founder, Embedded Vision Alliance; President, BDTI
Bier is a leading technologist at the intersection of computer vision, machine learning, and semiconductors. He will highlight leading-edge applications that illustrate how AI has begun to transform global industries. And, he’ll explain how proliferation of billions of AI-enabled devices will require – and enable –  a disruption in established semiconductor, software and system technologies.

Renée St. Amant, PhD
Research Engineer in Emerging Technologies and U.S. Innovator of the Year, Arm
St. Amant’s research background spans the computing stack and includes analog circuit design, innovation in machine learning training algorithms, and emerging applications across domains including healthcare. She will discuss a system design approach for delivering and developing intelligence at the interconnected edge.

PR (Chidi) Chidambaram, PhD
Vice President, Process Technology and Foundry Engineering, Qualcomm
Chidambaram has more than two decades of industry experience including developing Qualcomm’s most advanced process technologies and overseeing their production. He will discuss the technology needs of IoT devices and 5G connectivity and share his vision for enabling low-power AI Era computing. 

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