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Test Forum

In the new microelectronics space, everything is up for grabs.

Rapidly changing new technologies, accelerated product life cycles, IoT devices, wearable electronics and a host of other developments are driving a paradigm shift.  What’s ahead?  And what will it mean for you?

The Automated Test Equipment (ATE) industry sees a continuing pressure for higher yields, better quality, and lower cost of test with technology being driven by adoption of increased integration. At the Test Forum, you will explore topics relevant to strategic thinkers as well as test engineers. Technical papers will be presented on how different ATE vendors are solving today’s latest test challenges. Sessions will cover ongoing initiatives, current business and technology trends, as well as future challenges.

The Test Program will feature presentations from Test Vision 2020, the premier workshop in the area of automated test equipment, as well as activities from SEMI Collaborative Alliance for Semiconductor Test (CAST) special interest group. Test Vision 2020 will include sessions on adaptive test, while CAST will present on current activities aimed to enable adaptive test. CAST activities include the next-generation Standard Test Datalogging Format (STDF) called Rich Interactive Test Database (RITdb), and Tester Event Messaging for Semiconductor (TEMS).

If you are involved in technical or business leadership, you need the latest industry information. SEMICON West provides you with strategic insights from industry thought leaders to enable you to assess the landscape, identify opportunities, and develop strategic plans. Come to SEMICON West and connect with people in your community, discover what's new, and discuss what it means for your business.

Agenda


Tuesday, July 12

10:30–12:30pm

Test Executive Panel: Economics Perspectives at Test 

Session Sponsor: 
   

10:30–10:35am

Introduction: Ron Leckie, President, INFRASTRUCTURE Advisors

 

 

10:35–10:50am

The Value of Test: Yield, Time-to-Market
Octavio Martinez, Vice President of Engineering, Qualcomm

 

 

10:50–11:05am

Operational Efficiency Opportunities at Test
Dale Ohmart, Test Engineering, Texas Instruments

 

 

11:05–11:20am

Test Development Economics and Challenges
Greg Lewis, Director, Test Operations and Business Management at ISE Labs, ASE Group

 

 

11:20–11:35am

Test Development Economics
Michel Villemain, CEO, Presto Engineering

 

 

11:35–11:50am

Probe and Interface Economics|
Mike Slessor, FormFactor

 

 

 

11:50–12:30pm

Panel Discussion and Q&A
Moderator: Ron Leckie, INFRASTRUCTURE Advisors

2:00–4:00pm

Test Showcase   

Confirmed Speakers: 

  • Daniel Bock, Cascade Microtech
  • Brandon Mair, Probe Test Engineer, Texas Instruments
  • Carol McCuen, RF/Microwave Engineer, Altanova
  • Yuanjun Shi, CTO, Twin Solutions

Session Moderators:

  • Ira Feldman, Independent Technology Consultant, Feldman Engineering
  • Reynaldo Rincon, Probe Development Manager at Freescale Semiconductor, NXP

Wednesday, July 13

10:30–4:00pm

Test Vision 2020 presents: Adapting to the New Realities of Test (Day 1 of 2) 

 

Agenda (Day 1 of 2)

10:00–10:30am

Check in and Registration

 

 

       

10:30–10:35am

Welcome Remarks - General Chair: Amy Leong, FormFactor

 

     

10:35–10:40am

Program Overview - Program Chair: Stacy Ajouri, Texas Instruments

 

     

10:40–11:35 am

Keynote: Advanced Packaging Trends and the Impact on Test
Jan Vardaman, President,  TechSearch International 

 
     

11:35–11:40am

Break

 
     

Session 1:  Future of Analog Test  

Session Moderator: Paul Berndt, Test Engineering Fellow, Cypress Semiconductor

 
   

11:40–12:05pm

New ATE Solutions for Upcoming Analog Test
Derek Floyd, Director, Business Development, Advantest 

 
     

12:05–12:30pm

New Realities of Test: From the ATE Perspective
Devin Morris, Applications Engineer, Roos Instruments

 
     

12:30–2:00pm

Lunch

 
     

Session 2: Advanced Packaging, Advanced Test Challenges

Session Moderator: Tim Cleary, Sr. Director of Marketing, Cascade Microtech

 
   

2:00–2:25pm

Presentation of Best paper Award
Ben Brown, Vice President, IC Development & Digital Instruments, Xcerra

 
     

2:25–2:50pm

Verification of High-Bandwidth Memory (HBM) through direct probing on microbumps
Marc Loranger, Director of Test Technologies, FormFactor

 
     

2:50–3:15pm

Thermal Testing of Singulated Devices Gets Us Closer to Known-Good Die/Stack​
Dave Armstrong, Director of Business Development, Advantest

 

     

3:15–3:20pm

Session Raffle

 
     

3:20–4:20pm

Panel: 2.5D/3D/SIP: What should be tested, who should do it and where?

Moderator: Mike Alfano, AMD

Panelists:

  • Dave Armstrong, Director of Business Development, Advantest           
  • Krishnamoorthy Balachandran, Technical Leader, Cisco Systems
  • Gerard John,  Sr. Director Advanced Test, Amkor
  • Dave McCan, VP Packaging R+D and Business Technical Operations, GLOBALFOUNDRIES   
  • Bill Miller, Vice President of Engineering, Qualcomm
 
     

4:20–6:00pm

Reception and Poster Session 

  • A Data-Driven Approach to Automatic Test and Board Diagnostic Generation
    Chris Jacobs, Kalid Ahmad, Texas Instruments
     
  • Accelerating Characterization Process with Novel Real Time and Offline Analysis Techniques
    Steven McDowall, Wesley Smith, Galaxy Semiconductors
     
  • CAST RITdb Update: Streaming RITdb and demo
    Mark Roos, Roos Instruments
     
  • ATE Analytics System: A system to generate, collect, store and analyze tester inventory data.
    Stacy Ajouri, Texas Instruments
     
  • Automated Legacy Test Program Conversions
    Robert Almendarez, Texas Instruments

 

 

Thursday, July 14

10:30–4:00pm

Test Vision 2020 presents: Adapting to the New Realities of Test (Day 2 of 2) 

Agenda (Day 2 of 2)

10:00–10:30am

Check in and Registration

 
     

10:30–11:15am

Silicon is the New Steel: Building the Internet of Everything -- the World's First Terascale Network 
Invited Speaker: Professor Thomas Lee, Stanford University

 
     
11:15–11:20am Session 2 Raffle  
     

Session 3: Advanced Test Methods

Moderator: Steve Tilden, Tilden Consulting

 

 

11:20–11:45am

Using CPU for Mixed Signal Test
Bhavna Guidry, Test/Product/Firmware Engineer, Texas Instruments

 
     

11:45–12:10pm

ATE ResourceMerge Method for High Current Capability
Luis Parga, Hardware Engineer,Texas Instruments
Rafael Hernandez, Test Engineer, Texas Instruments

 
     

12:10–12:35pm

Design Driven Dynamic Pattern Data
Austin Nobis, Product Development Engineer II , AMD

 
     

12:35–2:00pm

Lunch

 
     
2:00–2:10pm Workshop Raffle  
     

2:10–2:55pm

Test & Robustness in Today’s Advanced Technologies
Invited Speaker: Yervant Zorian, Ph.D.,  Fellow & Chief Architect, Synopsys

 
     
2:55–3:00pm Session Raffle  
     

Session 4:  Shocking the Test Floor

Session Moderator: Geir Eide, Product Marketing Director , Mentor Graphics

 

 

3:00–3:25pm

Operational and Safety Considerations for Ultra-high-Voltage Integration into Semiconductor Testing
Joseph Yehle, Test Engineer, Texas Instruments

 
     

3:25–3:50pm

Experience of Data Analytics for Yield Optimization
Sebastian Siatkowski , Ph.D. Candidate, Graduate Student Researcher, UC, Santa Barbara

 
     

3:50–4:00pm

Closing Remarks – General Chair: Amy Leong, FormFactor

 
     

 

 

Thank you to our Test Vision 2020 Sponsors

 

Platinum Sponsors

     
       
 
       
   
       

Gold Sponsors

     
       
 
       
   

Silver Sponsors

     
       
 
       
       
 

Registration  for Test Vision 2020

 

By June 3            

Starting June 4

SEMI Member          

$255

$340

Non Member

$340

$445

  

Test Reception on Wednesday after the session included with Registration

Register Now    
     
     
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