Wayne Dai


Dr. Wayne Wei-Ming Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.

Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and the founding Chairman of IEEE Symposium on IC/Package Design Integration. He was an Associate Editor for IEEE Transactions on Circuits and Systems and an Associate Editor for IEEE Transactions on VLSI Systems. He has published over 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was elected as one the top ten venture-backed entrepreneurs in China in 2005, and elected as one of the 2005 top ten talents of science and technology in China. In 2007, he was recognized as The Ernst & Young Entrepreneur of the Year in China. In 2013, he was honored as The Executive of the Year of 2013 ACE Award. In 2014, he was awarded “Hurun Industry Achievement Award 2014”. He is currently the Executive Vice President of International Union for Science and Technology Innovation, the Vice President of China Semiconductor Industry Association IC Design Branch, and the President of Berkeley Shanghai Club.

Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering, both from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.




戴伟民博士于2001年8月创办了芯原并一直担任公司董事长、总裁兼首席执行官。在此之前,他曾出任美国Celestry公司(2002年被Cadence并购)公司董事长兼首席技术长,还曾是美国Celestry公司前身之一,美国Ultima的创始人、 董事长兼总裁。

戴博士是世界电子工程师协会多芯片模块国际会议的创办主席,世界电子工程师协会芯片封装综合设计研讨会的创办主席。他曾担任世界电子工程师协会电路和系统论文月刊和超大规模集成电路系统论文月刊的副编辑,在各类技术刊物和会议上发表过100多篇论文,并于1990年荣获美国总统青年研究奖。 戴博士曾获得2005年中国 “10大创业企业家”称号,并当选为“2005年中国十大科技英才”,2007年荣获安永企业家奖的殊荣,2013年获颁了2013中国年度电子成就奖之年度最佳管理者奖,2014年获颁胡润百富2014中国年度产业贡献奖。目前,戴博士担任创新科技国际联盟常务副理事长,中国半导体行业协会集成电路设计分会副理事长,伯克利大学上海校友会会长。


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