Dr. Jeffery W. Butterbaugh is currently Vice President of Engineering for TEL FSI, Inc. From 2003 to 2010, he served as co-chair of the Front End Processes Technology Working Group for the ITRS. He joined FSI International, Inc. (now TEL FSI, Inc.) in 1993 to lead process development for photochemical wafer cleaning and has since led process engineering teams for batch spray, batch immersion, vapor HF, cryogenic aerosol, and single wafer wet cleaning processes. Prior to joining FSI, Dr. Butterbaugh worked as a photolithography process engineer and a plasma etch development engineer for IBM in Burlington, Vermont and also as a sputter deposition and sputter etch engineer for Seagate Technology in Bloomington, Minnesota. Dr. Butterbaugh received his Ph.D. in Chemical Engineering from MIT and his B.S. in Chemical Engineering from the University of Minnesota. He holds 14 U.S. Patents and has authored or co-authored over 70 papers on surface conditioning and plasma etching.