Angélique Raley is an etch process development manager at Tokyo Electron Technology Center of America in Albany, NY. She graduated with an M.S. in materials science and engineering from Polytech’ Grenoble, France. She started her career in the semiconductor industry as an integration engineer for Samsung and for the past eight years at TEL she has worked on developing novel plasma etch processes and schemes for the front end and back end of line advanced technology nodes with a focus on multipatterning and EUV patterning. During her first 10 years in the industry, Angélique has been an active member of the semiconductor community and has contributed through multiple papers and patents to the steadfast advancement of key technologies to enable “the next node".