TechTALK: New Architectures to Enable the Intelligent Future

TechTALKS Stage South Wednesday, July 10
10:30am to 12:40pm

Current architectures using 2D packaging and interposer-based solutions may not be sufficient for future high-performance, high-data-bandwidth applications like Artifical Intelligence.  A variety of new ideas like monolithic or nre-monolithic 3D, in-memory processing, neuromorphic and quantum architectures are being studied.  This session presents some of these exciting ideas. 2.5D is today’s best solution, but a “true 3D” system combining logic and memory may be needed for the next quantum leap of performance, particularly for future IoT/AI applications.

Do you want to attend this session? Register for SEMICON West.

Carey Kloss
VP Artificial Intelligence Products Group, and General Manager of Artificial Intelligence Hardware
Bill Dally, PhD
Chief Scientist and SVP of Research
Greg Atwood
Senior Fellow, Process R&D
Jeff Burns
Client Success Manager, IBM Security
Kirk Bresniker
Chief Architect, Fellow, VP
Hewlett Packard Labs
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