Today’s explosive growth in data is boosting demand for new technologies to collect, store, analyze, and share it — and driving innovation in sensors, processors, memory, 5G, silicon photonics, integrations, and other kinds of chips. The electronics sector will need smarter tools and more effective data sharing with suppliers and customers to efficiently bring new technologies into profitable production. Join us in the Meet the Experts Theater to discuss these and other vital issues surrounding Smart Manufacturing, and learn what these emerging technologies can mean for your business. Afternoon sessisons will focus on emerging IC technologies for high volume, high bandwidth data. New memory, logic in memory.
Smart Manufacturing Meet the Experts Theater: High Density Packaging Technologies to Handle Data Volumes
Moscone South, Smart Manufacturing Pavilion, Meet the Experts Theater Thursday, July 12 1:30pm to 4:00pm
Do you want to attend this session? Register for SEMICON West.
3D X-ray Microscopy for High-Resolution Metrology Aids Semiconductor Packaging Development and Assembly
Solutions Manager, 3D X-ray Microscopy
PhD, Director, Business Development
Heterogenous 3D Integration by Wafer Nanobonding Without Ultra-high Vacuum and Low Temperature <220C for Advanced Packaging
PhD, CEO and CTO, Cactus Semiconductor and Adjunct Professor and Faculty Associate