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Heterogeneous Integration for High Performance Computing

Moscone South, TechXPOT South Wednesday, July 11
10:30am to 12:35pm

Co-hosted by the Electronic Packaging Society (EPS) of IEEE and the SEMI Americas Advanced Packaging Committee

The proliferation of consumer devices, the huge increase in data services, and the growing storage demands for a variety of data types have already lead to a growth in data centers. The next wave of demand will focus on driving even higher performance out of systems that input, compute, and store data. Further technical complexity will stem from the need to integrate newer optical and AI systems.

This session will focus on the increasing heterogeneity of these high performance computing systems, as well as new demands on the integration technologies needed. We will also look into some of the manufacturing technologies enabling the next generation of high performance computing.

Do you want to attend this session? Register for SEMICON West.

William Chen
PhD, ASE Fellow, Senior Technical Advisor
ASE
Li Li
PhD, Distinguished Engineer
Cisco Systems
Ken Hansen
President & CEO
Semiconductor Research Corporation
Bob Sankman
Fellow, Technology and Manufacturing Group, Co-Director, Pathfinding and Assembly and Packaging Technologies for 7nm Silicon and Beyond
Intel
Bahgat G. Sammakia
PhD, VP for Research
Binghamton University and Interim President of the SUNY Polytechnic Institute
Bill Bottoms
PhD, President and CEO
Third Millennium Test Solutions
William Chen
PhD, ASE Fellow, Senior Technical Advisor
ASE
Li Li
PhD, Distinguished Engineer
Cisco Systems
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