The Show Must Go On: Advanced Packaging to the Rescue

Thursday, July 13 3:40pm

As Moore's law slows down, a transformation of the semiconductor industry is underway—advanced packaging is now an integral part of the scaling and functionality roadmaps. Through incorporating 2.5D, 3D and WLCSP (fan-in and fan-out technologies), manufacturers are able to preserve their edge on their circuits’ shrink, reduce costs, and improve performance. The common theme despite the varying number of packaging technologies is to integrate and scale the system in package which in turn drives the sensitivity and accuracy required for process control.

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