Co-Design for Heterogeneous Integration

Wednesday, July 12 3:15pm

The talk is about the Co-design and Co-analysis methodologies for heterogeneous integration in various SiP technologies. It starts with implementation platforms for TSV based 3D-IC, and Fan out packaging technologies. He will discuss design flows for digital centric SOC, RF and MEMS integrated SiP. The talk also covers the co-analysis methodologies including modeling, system level power integrity analysis, layer based thermal analysis, multi-die cross coupling analysis, and MEMs multi-physics sub-flow.

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