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Advanced Packaging in the New World of Data

Wednesday, July 12 2:10pm

Industry reliance on advanced packaging has been accelerating over the last few years. This trend is expected to continue in the future. Heterogeneous integration of multiple chips in a package supports Moore’s Law scaling and is driving many challenges in package interconnect scaling, design environment, optical integration, electrical/thermal performance, and test. In this talk, future challenges and opportunities for advanced multi-chip packaging are addressed.

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