Learn how state-of-the-art IoT device platforms are delivering on the promise of IoT with innovative solutions for home automation, smart cities, industrial and environmental monitoring, healthcare, and more.
Organized by SEMI, IEEE Santa Clara Valley Section & the IEEE Computer Society
IoT devices collect data from or send data to the physical world. Microcontrollers, MEMS, sensors, and actuators form the building blocks of IoT device architecture. In recent years, there has been an explosive growth in the field of IoT devices. This session will focus on state-of-the-art IoT device platforms and their potential in IoT applications.
Jag Bolaria is Principal Analyst for embedded and servers at The Linley Group. During more than 20 years in the communications and semiconductor industries, he defined and launched products for computing and networking that shipped more than 100 million units. He has co-authored numerous technical publications, written several application notes and articles for EDN and other magazines, and has spoken at many industry events, including the Network Systems Design Conference, Northcon, Wescon, and Min/Micro.
Dr. Stephen Renwick, PhD has worked on leading-edge lithography for eighteen years, starting with the first ArF scanners in 1996. He has been with Nikon subsidiaries in the US since 2000, and is currently a Senior Research Scientist managing part of the company’s Imaging Solutions Technology Development Group. Steve is a frequent contributor to industry conferences such as SPIE Advanced Lithography and the invitation-only Lithography Workshop. He has published detailed technical papers in conference proceedings as well as introductory articles for non-experts.
Dr. Bryan Barnes serves as Project Leader for the Optical Methods for 3-D Nanostructure Metrology project in the Engineering Physics Division of NIST’s Physical Measurement Laboratory. He is also the co-chair of the North America Chapter of the SEMI Microlithography Committee, which through voluntary compliance enhances the manufacturing capability of the semiconductor industry through consensus-based specifications. The author of more than 40 proceeding and journal papers, he also holds a patent in overlay metrology.
David Horsley is a Professor in the Department of Mechanical and Aerospace Engineering at the University of California, Davis, and Co-Director of the Berkeley Sensor and Actuator Center (BSAC). He is also a co-founder and CTO of Chirp Microsystems, a manufacturer of ultrasonic sensors using MEMS technology, and a co-founder of Picosense, a developer of low-noise magnetoresistive sensors. He was the co-chair of the 2016 IEEE Sensors Conference and the Transducer Research Foundation’s 2017 Napa Microsystems Workshop.
Jean-Christophe Eloy is CEO and Founder of Yole Développement, the “More than Moore” market research and strategy consulting company. Since 1991, he has been involved in the analysis of the evolution of MEMS markets at the device, equipment, and materials-supplier levels. Jean-Christophe is a board member in several industry organizations in Europe and North America.
Mr. Jamil Kawa joined Synopsys in 1998 where he is currently a Group Director of R&D in the Advanced Technology Group overseeing projects in the DFM / DFY (Design for Manufacturability and Design for Yield) and in emerging storage technologies. Mr. Kawa is also responsible for overseeing the technology roadmap that his group publishes internally as well as organizing areas of focus and key topics for technology off sites and seminars. Mr.
Tim Wong works with customers, partners, and suppliers to enable autonomous vehicle technologies using the NVIDIA Automotive DRIVE PX platform and deep neural networks for high-quality, robust, and flexible self-driving solutions. Before joining NVIDIA, Tim was the president of the MHL Consortium where he drove the adoption and licensing of MHL technology into more than 900 million smartphones, displays, and accessories.
Dr. Brian McKay is responsible for developing and demonstrating advanced system-level solutions to improve powertrain performance, increase vehicle efficiency, and reduce exhaust emissions at Continental Automotive Systems. His passion is to tackle next-generation challenges by combining engineering fundamentals with outside-the-box thinking.