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Advanced Packaging Technologies Enabling Advanced Applications

Hosted by the SEMI Americas Advanced Packaging Committee

Following up on our previous session, we will dig into the key packaging technologies enabling the advanced electronic systems that we have seen come to the market recently. Wafer-level packaging (WLP), 2.5D (interposer), embedded substrates, and, perhaps most comprehensively, SiP (System-in-Package) have been true inflections in enabling many of these new systems. We will also delve into the challenges in current technologies and opportunities for extending and improving them.

Session Chairs: 

Test Vision 2020: Fast Track to Smarter Test (Day 1)

Test Vision 2020 is today's premier workshop for semiconductor and system test experts with a vision towards the future of test. It is a highly anticipated gathering of providers and users of test IP and equipment, all converging to engage with leaders in the field and discuss coming trends and requirements. The conference typically has hundreds of participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience.

Next Generation Smart Manufacturing: Collaboration Towards Enabling Practical Predictive Analytics and Traceability Across the Electronics Supply Chain

Co-Hosted by the SEMI Smart Manufacturing Advisory Council

Smart Manufacturing is driving impressive growth for microelectronics. But continued success requires more collaboration and process control across an increasingly interconnected electronics value chain. Learn all about the challenges and opportunities.

Material Supply Challenges for Current & Future Leading-edge Devices

Hosted by the SEMI Chemical & Gas Manufacturers Group (CGMG)

As leading-edge devices move into 10nm and sub-10nm nodes, the challenge of maintaining a supply chain that can provide in-spec and in-ship-to-control materials increases dramatically. In

this session, technology and thought leaders from device, materials, and metrology companies will dig into tough questions and provide some clarity and guidance in order for the industry to realize the next generation of devices.

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