| A |
|
|
| Advantest |
Angarai Sivaram
|
Semiconductor Test: Smarter, Faster, More Productive
|
| Alta Devices |
Nasreen Chopra |
4th Annual SEMI North American PV Fab Managers Forum
|
| Altera Corporation |
John Xie |
Advancing 2.5D and 3D Packaging through Value Engineering
|
| American Semiconductor |
Douglas R. Hackler |
Integrating Conventional Silicon in Flexible Electronics
|
| Amkor Technology |
Ron Huemoeller |
Advancing 2.5D and 3D Packaging through Value Engineering
|
|
Amkor Technology
|
Roger St. Amand
|
Generation
Mobile:Enabled by IC Packaging
Technologies
|
|
Applied Materials
|
Adam Brand
|
Leveraging
Nonplanar Transistor Architectures and New Materials to Power Mobility Apps
Beyond 20nm
|
Applied Materials
|
Kirk Hasserjian |
SEMICON West 450mm Transition Forum
|
|
ASE
|
Jenny Chang
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
| ASE |
Calvin Cheung |
Advancing 2.5D and 3D Packaging through Value Engineering
|
|
ASE
|
John Hunt
|
Generation
Mobile: Enabled by IC Packaging
Technologies
|
|
ASET (Association of Super-Advanced Electronics Technologies)
|
Hiroaki Ikeda |
Advancing 2.5D and 3D Packaging through Value Engineering
|
|
ASML
|
Skip Miller
|
Still a Tale of Two
Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and
Infrastructure Progress
|
|
AT&S
|
Johannes Stahr
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
|
Azzurro Semiconductors
|
Alexander Loesing
|
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology
|
| B |
|
|
|
BodyMedia
|
Ivo Stivoric
|
Adding Value in
Next Generation MEMS
|
| Brewer Science |
Stephen Gibbons
|
Lab-to-Fab: From R&D to High Volume Manufacturing
|
|
Bridgelux
|
Max Hong |
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology
|
| C |
|
|
|
CEA-Leti
|
Laurent Malier
|
SEMICON
West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor
Technology”
|
|
Cisco
|
Mark Nowell
|
Building an
Infrastructure for Silicon Photonics
|
|
College of Nanoscale Science
and Engineering (CNSE)
|
Michael Liehr
|
SEMICON
West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor
Technology”
|
|
Coventor
|
David Fried
|
Lab-to-Fab: From R&D
to High Volume Manufacturing
|
|
Cowen and Company
|
Tim Arcuri
|
Bulls and Bears
|
|
Credit Suisse
|
Satya Kumar
|
Bulls and Bears
|
| D |
|
|
| Distributed Sun |
Chase Weir |
SEMI PV Materials and Reliability Expert Forum
|
| Dai Nippon Printing Co., Ltd. |
Satoru Kuramochi |
MEMS & Sensor
Packaging for the Internet of Things
|
| DuPont |
Eric Romano |
SEMI PV Materials and Reliability Expert Forum
|
| E |
|
|
|
Entegris
|
Bertrand Loy
|
SEMICON
West 2013 Executive Panel– “A Promising but Challenging Future”
|
| EV Group |
Thorsten Matthias |
MEMS & Sensor
Packaging for the Internet of Things |
| F |
|
|
| Fairchild Semiconductor |
Janusz Bryzek |
MEMS & Sensor
Packaging for the Internet of Things
|
|
FEI Company
|
Don Kania
|
Bulls and Bears
|
|
Flextronics
|
Scott Graybeal |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Flextronics
|
Erik Volkerink |
Test Vision 2020
|
|
|
|
| G |
|
|
| Gartner |
David Christensen
|
SEMI/Gartner Market
Symposium
|
| Gartner |
Bob Johnson |
SEMI/Gartner Market
Symposium
|
| GCL Solar |
Sean Tzou |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Gestamp Solar
|
Pablo Otin |
SEMI PV Materials and Reliability Expert Forum
|
| Global 450mm Consortium |
Paul Farrar |
SEMICON West 450mm Transition Forum
|
GLOBALFOUNDRIES
|
Carlo Dominic Aparece |
Lab-to-Fab: From R&D to High Volume Manufacturing
|
|
GLOBALFOUNDRIES
|
Paul Besser |
Materials Growth Opportunities at Both Ends of the Spectrum
|
| GLOBALFOUNDRIES |
Subramani Kengeri |
Leveraging
Nonplanar Transistor Architectures and New Materials to Power Mobility Apps
Beyond 20nm
|
|
GLOBALFOUNDRIES
|
Ajit Manocha
|
SEMICON
West Opening Keynote
|
|
GLOBALFOUNDRIES
Singapore Pte. Ltd.
|
Rakesh Kumar
|
Adding Value in
Next Generation MEMS
|
| |
|
|
| H |
Hugh Kuhn |
SEMI PV Materials and Reliability Expert Forum |
| HAK Solar Advisory Services |
|
|
| Hitachi Chemical |
Itsuo Watanabe |
Advancing 2.5D and 3D Packaging through Value Engineering
|
| |
|
|
| I |
|
|
|
IBM
|
George Gomba
|
Leveraging
Nonplanar Transistor Architectures and New Materials to Power Mobility Apps
Beyond 20nm
|
| IBM |
Gerd Pfeiffer |
Silicon Wafers - Future Standardization to Enable the Transition |
|
IBM
|
Yurii Vlasov
|
Building an
Infrastructure for Silicon Photonics
|
|
imec
|
Luc Van den hove
|
SEMICON
West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor
Technology”
|
|
Integrated Photovoltaics
|
Sharone Zehavi |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Intel
|
Mostafa Aghazadeh
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
| Intel |
Mike Goldstein |
Silicon Wafers - Future Standardization to Enable the Transition
|
|
Intrinsiq Materials
|
Richard Dixon
|
Materials Growth Opportunities at Both Ends of the Spectrum
|
| J |
|
|
|
Jabil
|
Quyen Chu |
Integrating Conventional Silicon in Flexible Electronics
|
|
JSR Corporation
|
Nobu Koshiba
|
SEMICON
West 2013 Executive Panel– “A Promising but Challenging Future”
|
|
K
|
|
|
KLA Tencor
|
Steven Chen |
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology
|
| KLA Tencor |
Brian Trafas |
SEMICON West 450mm Transition Forum
|
|
Kotura
|
Mehdi Asghar |
Building an Infrastructure for Silicon Photonics
|
| KPMG |
Ron Steger |
Advancing 2.5D and 3D Packaging through Value Engineering
|
|
Kyocera
|
Koichi Nonomura
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
| L |
|
|
|
Lam Research
|
Martin Anstice
|
SEMICON
West 2013 Executive Panel – “A Promising but Challenging Future”
|
| Lam Research |
Mark Fissel |
SEMICON West 450mm Transition Forum
|
|
Lazard Capital
|
Sanjay Shrestha
|
4th Annual SEMI North American PV Fab Managers Forum
|
|
Linx Consulting, LLC
|
Mark Thirsk |
Materials Growth Opportunities at Both Ends of the Spectrum
SEMI PV Materials and Reliability Expert Forum
|
|
Luxtera
|
Peter De Dobbelaere
|
Building an
Infrastructure for Silicon Photonics
|
| M |
|
|
| M&W Group/G450C |
Allen Ware |
Silicon Wafers - Future Standardization to Enable the Transition |
|
Matheson
|
Bruce Adams |
SEMI PV Materials and Reliability Expert Forum
|
| McKinsey
& Company |
Stefan
Heck |
4th Annual SEMI North American PV Fab Managers Forum |
|
MEMC
|
Milind Kulkarni |
4th Annual SEMI North American PV Fab Managers Forum
|
| MEMC Solar Materials |
Ali Nouri |
SEMI PV Materials and Reliability Expert Forum
|
| Mentor Graphics |
Martin Keim |
Semiconductor Test: Smarter, Faster, More Productive |
|
Mentor Graphics
|
Wally Rhines
|
SEMICON
West 2013 Executive Panel– “A Promising but Challenging Future”
|
|
Mentor Graphics
|
Joe Sawicki
|
Leveraging
Nonplanar Transistor Architectures and New Materials to Power Mobility Apps
Beyond 20nm
|
|
Micron
|
Scott Graham
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
Multitest Electronics Systems
|
James Quinn
|
Semiconductor Test: Smarter, Faster, More Productive
|
| N |
|
|
|
Nanium
|
Jose Campos
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
|
National Instruments
|
Luke Schreier
|
Semiconductor Test: Smarter, Faster, More Productive
|
| Nikon Precision |
Hamid Zarringhalam |
SEMICON West 450mm Transition Forum
|
|
Nikon Research Corporation
of America
|
Stephen Renwick
|
Still a Tale of Two
Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and
Infrastructure Progress
|
|
North Carolina State University
|
Dan Herr |
Materials Growth Opportunities at Both Ends of the Spectrum
|
| O |
|
|
|
|
|
| OptimalTest |
Danny Glotter |
Semiconductor Test: Smarter, Faster, More Productive
|
|
|
|
| P |
|
|
| PARC, a Xerox company |
Ross Bringans |
SEMI/Gartner Market
Symposium
|
|
Philips Lumileds
|
Wouter Soer |
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology
|
| Photonic Controls, LLC |
B. Roe Hemenway |
Building an Infrastructure for Silicon Photonics
|
|
Portland State University
|
Sung Yi
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
| PricewaterhouseCoopers, LLC |
Chris Richard |
SEMICON West 450mm Transition Forum
|
| R |
|
|
|
Robert Bosch GmbH
|
Jiri Marek, Ph.D.
|
MEMS & Sensor
Packaging for the Internet of Things
|
| S |
|
|
|
S.K. Hynix
|
Nick (Namseog) Kim
|
IEEE/CPMT Workshop
on:
“THIN IS IN": Thin Chip & Packaging Technologies as Enablers for
Innovations in the Mobility Era
|
| Samsung/G450C |
Kwangkook Lee |
Silicon Wafers - Future Standardization to Enable the Transition
|
|
Sandia National Laboratories
|
Dahwey Chu
|
Integrating Conventional Silicon in Flexible Electronics
|
|
SEMATECH
|
Daniel Armbrust
|
SEMICON
West 2013 R&D Panel–
“A Conversation on the Future of Semiconductor
Technology”
|
|
SEMATECH
|
Paul Kirsch
|
Leveraging Nonplanar
Transistor Architectures and New Materials to Power Mobility Apps Beyond 20nm
|
|
SEMATECH
|
Stefan Wurm
|
Still a Tale of Two
Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and Infrastructure
Progress
|
|
SEMI
|
Thomas Morrow
|
SEMI/Gartner Market
Symposium
|
|
SEMI
|
Mark Stromberg
|
SEMI/Gartner Market
Symposium
|
|
SEMI
|
Dan Tracy
|
SEMI/Gartner Market
Symposium
|
|
SEMI
|
Ray Morgan |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Seren Photonics, Ltd
|
Carl Griffiths
|
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology
|
|
SK Hynix
|
Minho Kim
|
Generation
Mobile: Enabled by IC Packaging
Technologies
|
|
Solar PV Market Research
|
Paula Mints |
4th Annual SEMI North American PV Fab Managers Forum
|
|
SolarCity, U.S.
|
Jimmy Chuang |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Solexant
|
Brad Mattson |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Stifel, Nicolaus & Co.
|
Patrick Ho
|
Bulls and Bears
|
| STATS ChipPAC |
Raj Pendse |
Advancing 2.5D and 3D Packaging through Value Engineering
|
|
STMicroelectronics
|
Michel Haond
|
Leveraging
Nonplanar Transistor Architectures and New Materials to Power Mobility Apps
Beyond 20nm
|
| SUMCO |
Hisashi Furuya |
Silicon Wafers - Future Standardization to Enable the Transition |
| SunEdison |
Sean Kiernan |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Susquahanna International Group
|
Mehdi Hosseini
|
Bulls and Bears
|
|
Synopsys
|
Mike Rieger
|
Still a Tale of Two
Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and
Infrastructure Progress
|
| T |
|
|
|
TEL (Tokyo Electron Limited)
|
Ben Rathsack
|
Still a Tale of Two
Paths: Multi-patterning Lithography at 20nm and Below- EUVL Source and
Infrastructure Progress
|
| TEL (Tokyo Electron Limited) |
Akihisa Sekiguchi |
SEMICON West 450mm Transition Forum
|
| TEL NEXX |
Thomas Walsh |
Advancing 2.5D and 3D Packaging through Value Engineering
|
| Terepac Corporation |
Jayna Sheats
|
Integrating Conventional Silicon in Flexible Electronics
|
| Texas Instruments |
Charlie Weinberger |
Semiconductor Test: Smarter, Faster, More Productive
|
|
Texas Instruments
|
Gina Park
|
Adding Value in
Next Generation MEMS
|
| Thin Film Electronics |
Chandrasekhar Durisety
|
Integrating Conventional Silicon in Flexible Electronics
|
| TSMC/G450C |
Pinyen Lin |
Silicon Wafers - Future Standardization to Enable the Transition
|
| U |
|
|
|
UBM TechInsights
|
John Scott-Thomas
|
Generation
Mobile:Enabled by IC Packaging
Technologies
|
| United Microelectronics Corporation (UMC) |
Kurt Huang |
Advancing 2.5D and 3D Packaging through Value Engineering
|
| U.S. Department of Energy |
Douglas Hall |
SEMI PV Materials and Reliability Expert Forum
|
|
U.S. Department of Energy
|
Lidija Sekaric |
4th Annual SEMI North American PV Fab Managers Forum
|
|
U.S. Department of Energy,
First Energy Finance
|
David Arfin |
4th Annual SEMI North American PV Fab Managers Forum
|
|
Universal Scientific Industrial (USI)
|
Harrison Chang
|
Generation
Mobile: Enabled by IC Packaging
Technologies
|
| V |
|
|
|
VTT Technical Research
Centre of Finland
|
Aarne Oja
|
MEMS & Sensor
Packaging for the Internet of Things
|
| X |
|
|
|
Xfab
|
Iain Rutherford
|
Adding Value in
Next Generation MEMS
|
| Y |
|
|
| Yingli |
Brian Grenko |
SEMI PV Materials and Reliability Expert Forum
|
|
Yole Développement
|
Jean-Christophe Eloy
|
Adding Value in
Next Generation MEMS
|
| Yole Développement |
Christophe Fitamant
|
Materials Growth Opportunities at Both Ends of the Spectrum
|
| Yole Développement |
Eric Virey |
Looking Ahead to
the Next Generation of HB LED Manufacturing Technology |
|
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