FlexTech Alliance Workshop: Flexible Hybrid Electronics for Wearable Applications – Challenges and Solutions







Thursday, July 10, 2014
San Francisco Marriott Marquis


Flexible hybrid electronics (FHE) draws equipment, materials, design and manufacturing processes from two industries: the semiconductor industry and the traditional printing industry.  FlexTech Alliance explores this interesting technology merger in a one-day workshop at SEMICON West 2014.  One of the fastest growing applications for Flexible Hybrid Electronics is wearable electronic devices for health and human performance monitoring. This workshop will include a review of some of these applications.


The semiconductor industry has evolved not only exponentially in terms of capability, but also in the applications it pursues. A recent direction is referred to as “More Than Moore”. Activity in this space seeks to address needs for more capability for wearable/flexible/conformal systems (even implantable), large size/distributed systems, and low cost (even disposable) sensor and smart packaging systems.


Recently, printed electronics has made great progress in materials and processing technologies for flexible, conformable and robust applications such as wearable biomedical sensors and imagers, displays, consumer packaging, and toxic and structural sensors.  Almost simultaneously, various techniques are emerging for creating very thin silicon chips and packages as well as flexible PC “boards” that can be incorporated in flexible systems. Finding ways to cost effectively and reliably integrate conventional processors, MEMS sensors, and high speed RF communications with printed/flexible electronics systems opens the door to wider applications, including wearables.


Where do printed/flexible electronics systems offer the best solutions? Where could integrating traditional silicon into a flexible electronics format make most sense for cost or performance? What are the industry-wide challenges and promising solutions for process integration, handling, packaging, and testing hybrid silicon and flexible approaches? Join with subject matter experts and end users to answer these and other pertinent questions.




Introduction and Overview

Malcolm Thompson

FlexTech Alliance



Flexible Hybrid Electronics for Wearable Applications

Stein Lundby

QUALCOMM Incorporated



Monolithic 3D – Challenges and Solutions

Brian Cronquist

MonolithIC 3D Inc. 



Enabling Flexible Hybrid Electronics with the FleX Development Kit

Rich Chaney

American Semiconductor, Inc. 




Digital Fabrication of Flexible Electronic Systems

Gregory Whiting

Palo Alto Research Center (PARC) 







Flexible Hybrid Systems for Wearable Electronics: Perspective from an Integrator and Manufacturer

John Heitzinger




Truly Wearable Electronics

Jayna Sheats

Terepac Corporation



High Energy Density, Thin, Safe and Flexible Power for Hybrid Wearable Electronics and Internet of Things Products

Devin MacKenzie

Imprint Energy






Roll to Roll Thick & Thin Film Processing for Display Based Applications

Neil Morrison

Applied Materials Web Coating GmbH



Integrated Process Metrology and Control

Mark Wegner

Northfield Automation Systems Inc. 



Closing Remarks

Malcolm Thompson

FlexTech Alliance






By June 6 After June 6
SEMI/FlexTech Member $299 $399
Non Member $399 $499


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