FlexTech Alliance Workshop: Flexible Hybrid Electronics – Challenges and Solutions
Thursday, July 10, 2014
San Francisco Marriott Marquis
Flexible hybrid electronics (FHE) draws equipment, materials, design and manufacturing processes from two industries: the semiconductor industry and the traditional printing industry. FlexTech Alliance explores this interesting technology merger in a one-day workshop at SEMICON West 2014.
The semiconductor industry has evolved not only exponentially in terms of capability, but also in the applications it pursues. A recent direction is referred to as “More Than Moore”. Activity in this space seeks to address needs for more capability for wearable/flexible/conformal systems (even implantable), large size/distributed systems, and low cost (even disposable) sensor and smart packaging systems. Recently, printed electronics has made great progress in materials and processing technologies for flexible, conformable and robust applications such as wearable biomedical sensors and imagers, displays, consumer packaging, and toxic and structural sensors. Almost simultaneously, various techniques are emerging for creating very thin silicon chips and packages as well as flexible PC “boards” that can be incorporated in flexible systems. Finding ways to cost effectively and reliably integrate conventional processors, MEMS sensors and high speed RF communications with printed/flexible electronics systems opens the door to wider applications.
Where do printed/flexible electronics systems offer the best solutions? Where could integrating traditional silicon into flexible electronics format make most sense for cost or performance? What are the industry-wide challenges and promising solutions for process integration, handling, packaging, and testing hybrid silicon and flexible approaches? Join with subject matter experts and end users to answer these and other pertinent questions.
|By June 6||After June 6|
How to Register for this Program