ITRS Back End of Line Technologies
Thursday, July 11
TechXPOT North, North Hall
The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups present the challenges for future interconnects—such as through silicon vias (TSVs); the latest roadmaps for semiconductor assembly; systems packaging applications, “More than Moore” in the ITRS roadmap chapters, and the testing considerations for these quickly changing technologies. They will also discuss the increased focus on applications like micro-electro-mechanical systems (MEMS) and radio frequency and analog/mixed-signal technologies (RFAMS). Presentations include the chapters for interconnect, assembly and packaging, test, MEMS, and RFAMS.
Session presented in cooperation with
Please check back frequently for updates and more information as agendas develop and speakers are announced.
How to Register for this Program
|I'm Already Registered for SEMICON West
I Have Not Registered for SEMICON West
|Login to the Registration Resource Center and select “Agenda Builder” to add this program.||Begin a new registration form and select this program and any others you wish to attend during Step 2.|