ITRS Back End of Line Technologies

Thursday, July 11
1:30pm-4:00pm
TechXPOT North, North Hall

The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups present the challenges for future interconnects—such as through silicon vias (TSVs); the latest roadmaps for semiconductor assembly; systems packaging applications, “More than Moore” in the ITRS roadmap chapters, and the testing considerations for these quickly changing technologies.  They will also discuss the increased focus on applications like micro-electro-mechanical systems (MEMS) and radio frequency and analog/mixed-signal technologies (RFAMS). Presentations include the chapters for interconnect, assembly and packaging, test, MEMS, and RFAMS.

Session presented in cooperation with

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