ITRS Back End of Line Technologies

Thursday, July 11
TechXPOT North, North Hall


The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups present the challenges for future interconnects—such as through silicon vias (TSVs); the latest roadmaps for semiconductor assembly; systems packaging applications, “More than Moore” in the ITRS roadmap chapters, and the testing considerations for these quickly changing technologies.  They will also discuss the increased focus on applications like micro-electro-mechanical systems (MEMS) and radio frequency and analog/mixed-signal technologies (RFAMS). Presentations include the chapters for interconnect, assembly and packaging, test, MEMS, and RFAMS.


Greeting from the ITRS IRC Chair    

IRC Session Chair from Japan-Hidemi Ishiuchi


Overall Roadmap Technology Characteristics (ORTC)
IRC Member from USA-Bob Doering


More than Moore

IRC Member from Europe - Patrick Cogez

2:10pm-2:25pm Interconnect
Paul Feeney, Axus Technology
2:25pm-2:40pm Test and Test Equipment

Roger Barth

2:40pm-2:55pm Assembly and Packaging

Bill Bottoms


Micro-electro-mechanical systems (MEMS)

Michael Gaitan


RF and Analog/Mixed-Signal Technologies (RFAMS)

Herb Bennett



3:30pm-3:35pm Closing Remarks
IRC Chair



Session presented in cooperation with


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