ITRS Back End of Line Technologies

Thursday, July 11
1:30pm-3:35pm
TechXPOT North, North Hall

 

The ITRS is undergoing a major change this year to reflect the market evolution towards highly mobile flexible devices that allow the users to highly customize them to their liking. As a result he new 2013 ITRS will span from Equivalent Scaling to Customized Functionality. These ITRS working groups present the challenges for future interconnects—such as through silicon vias (TSVs); the latest roadmaps for semiconductor assembly; systems packaging applications, “More than Moore” in the ITRS roadmap chapters, and the testing considerations for these quickly changing technologies.  They will also discuss the increased focus on applications like micro-electro-mechanical systems (MEMS) and radio frequency and analog/mixed-signal technologies (RFAMS). Presentations include the chapters for interconnect, assembly and packaging, test, MEMS, and RFAMS.

 

1:30pm-1:35pm         
Greeting from the ITRS IRC Chair    

IRC Session Chair from Japan-Hidemi Ishiuchi

 
1:35pm-1:50pm

Overall Roadmap Technology Characteristics (ORTC)
IRC Member from USA-Bob Doering

 
1:50pm-2:10pm

More than Moore

IRC Member from Europe - Patrick Cogez

 
2:10pm-2:25pm Interconnect
Paul Feeney, Axus Technology
 
2:25pm-2:40pm Test and Test Equipment

Roger Barth

 
2:40pm-2:55pm Assembly and Packaging

Bill Bottoms

 
2:55pm-3:10pm

Micro-electro-mechanical systems (MEMS)

Michael Gaitan

 
3:10pm-3:25pm

RF and Analog/Mixed-Signal Technologies (RFAMS)

Herb Bennett

 
3:25pm-3:30pm

Q&A

 
3:30pm-3:35pm Closing Remarks
IRC Chair

 

 

Session presented in cooperation with

 

Please check back frequently for updates and more information as agendas develop and speakers are announced.


View Schedule of Events

 

 

How to Register for this Program

 

 

I'm Already Registered for SEMICON West

I Have Not Registered for SEMICON West



Login to the Registration Resource Center and select “Agenda Builder” to add this program. Begin a new registration form and select this program and any others you wish to attend during Step 2.
Bookmark and Share