Integrating Conventional Silicon in Flexible Electronics

Thursday, July 11
10:30am–1:10pm
South Hall, Moscone Center

 

 

            Session Partner:  

 
     

Description

Printed electronics have made great progress in materials and processing technologies for flexible, conformable and robust applications such as wearable biomedical sensors and imagers, displays, consumer packaging, and toxic and structural sensors. Some of the flexible electronics systems incorporate both printed electronics and silicon technology.  Various techniques are available for creating very thin silicon chips that can be incorporated in flexible systems. Finding ways to cost effectively and reliably integrate more conventional processors or MEMS sensors or high speed RF communications with printed/flexible electronics systems may open the way to wider applications. Where do printed/flexible electronics systems offer the best solutions? Where could integrating traditional silicon make most sense for cost or performance? What are the remaining challenges and promising solutions for process integration, handling, packaging, integrating and testing hybrid silicon/flexible approaches?

  

 

 

10:30am-10:35am  

Opening Remarks:

Michael Ciesinski (Biography)

President and CEO

FlexTech Alliance  

 
10:35am-11:00am

FleX™ Silicon-on-Polymer™: Flexible Electronics from Conventional Silicon ICs
 (Presentation in PDF)

Douglas R. Hackler (Biography)

President and CEO

American Semiconductor


 
11:00am-11:25am

Investigation of Components Attachment onto Low Temperature Flex Circuit
(Presentation in PDF)


Quyen Chu
(Biography)
Advanced Technology Engineering Manager
Jabil

 
11:25am-11:50am

Techniques for Die Extraction and Thinning of COTS
Electronic in the Prototyping of Flex Systems

(Presentation in PDF)

 

Dahwey Chu (Biography)
Principal Member of Technical Staff, Microsystems Integration Department
Sandia National Laboratories

 
 
11:50am-12:15pm Flexible Silicon-based Micromodules for the Internet
of Things

(Presentation in PDF)

Jayna Sheats, Ph.D
. (Biography)
Chief Technical Officer
Terepac Corporation
 
12:15pm-12:40pm

Reshaping Electronics for the Human Body

(Presentation in PDF)

Yung-Yu Hsu, Ph.D.
(Biography)
Research Scientist
MC10
 
12:40pm-1:05pm

Introduction to Thinfilm Technology
(Presentation in PDF)


Chandrasekhar Durisety, Ph.D.
(Biography)
Assistant Director
Thin Film Electronics

 
1:05pm-1:10pm    Closing Remarks

Michael Ciesinski (Biography)

President and CEO

FlexTech Alliance  

 

 


Please check back frequently for updates and more information as agendas develop and speakers are announced.


View Schedule of Events

 

 

How to Register for this Program

 

 

I'm Already Registered for SEMICON West

I Have Not Registered for SEMICON West



Login to the Registration Resource Center and select “Agenda Builder” to add this program. Begin a new registration form and select this program and any others you wish to attend during Step 2.
Bookmark and Share Google+