Search
 |
Exclusive Media Partner: |
 |
||
| Supporter: |  |
|||
| MEMS & Sensor Packaging for the Internet of Things | ||||
| Thursday, July 11 10:30am–1:00pm North Hall, Moscone Center |
||||
Hosted by the Advanced Packaging Committee, SEMI Americas
|
MEMS technology has gone a long way since its early conception, helping now billions of devices to act and collaborate with their ambient. Early adopters from the car and machining industry were followed by the mobile phone industry and more recently medical technology providers.
Not only the sensors have evolved, but also the packaging and integration technologies have gone from controlled stress packaging and housing to allow the functioning of these devices under the required operation conditions, but also selective hermeticity for controlled medium access, the combination of multiple sensors in one device and not to the least integrating intelligence by microcontrollers and even energy supply and wireless transmission solutions were conceptualized and implemented. Especially the latter advancements will be enabling the technological evolution from embedded systems to cyber-physical systems (Industry 4.0 revolution) by autonomous intelligent sensor systems. This session will feature speakers from all parts of the ecosystem to address how future visions will be realized through the heterogeneous integration of MEMS and ICs. |
|
|
Session Co-chairs: Dr. Klaus-Dieter Lang, Director, Fraunhofer IZM Kishor Desai, Manager, Advanced Packaging, Cisco Systems Rolf Aschenbrenner, Head of Department, Fraunhofer IZM
|
|
| Agenda | |
| 10:30am-11:00am |
Keynote Speaker Janusz Bryzek VP Development, MEMS and Sensing Solutions Fairchild Semiconductor
|
|
| 11:00am-11:30am |
Keynote Speaker Jiri Marek, Ph.D. Senior Vice President of Engineering Sensors, Automotive Electronics Division, Robert Bosch GmbH
|
|
| 11:30am-11:50am |
|
MEMS microspectrometers based on Fabry-Perot interferometers Aarne Oja Research Professor, Director, High Performance Microsystems Programme VTT Technical Research Centre of Finland |
| 11:50am-12:10pm |
|
Development of Silicon Interposer for Advanced Package
Satoru Kuramochi (Biography) Deputy General Manager Next Generation MEMS Laboratory Research and Development Center Dai Nippon Printing Co., Ltd.
|
|
|
||
| 12:10pm-12:30pm |
From Sensor Fusion to System Fusion
Thorsten Matthias Head of Business Development EV Group
|
|
|
|
||
| 12:30pm-1:00pm |
Questions/Discussion (Moderator/Speakers)
|
|
|
How to Register for this Program
|
|||||||||||
| I'm Already Registered for SEMICON West |
I Have Not Registered for SEMICON West |
||||||||||
 |
Login to the Registration Resource Center and select “Agenda Builder” to add this program. |  |
Begin a new registration form and select this program and any others you wish to attend during Step 2. | ||||||||
