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MEMS & Sensor Packaging for the Internet of Things
Thursday, July 11, 2013
North Hall, Moscone Center

Hosted by the Advanced Packaging Committee, SEMI Americas


MEMS technology has gone a long way since its early conception, helping now billions of devices to act and collaborate with their ambient. Early adopters from the car and machining industry were followed by the mobile phone industry and more recently medical technology providers.


Not only the sensors have evolved, but also the packaging and integration technologies have gone from controlled stress packaging and housing to allow the functioning of these devices under the required operation conditions, but also selective hermeticity for controlled medium access, the combination of multiple sensors in one device and not to the least integrating intelligence by microcontrollers and even energy supply and wireless transmission solutions were conceptualized and implemented. Especially the latter advancements will be enabling the technological evolution from embedded systems to cyber-physical systems (Industry 4.0 revolution) by autonomous intelligent sensor systems.


This session will feature speakers from all parts of the ecosystem to address how future visions will be realized through the heterogeneous integration of MEMS and ICs.


Session Co-chairs:

Dr. Klaus-Dieter Lang, Director, Fraunhofer IZM

Kishor Desai, Manager, Advanced Packaging, Cisco Systems

Rolf Aschenbrenner, Head of Department, Fraunhofer IZM






Keynote - Emergence of Trillion Sensors Opportunity

(Presentation in PDF)

Janusz Bryzek, Ph.D. (Biography)

VP Development, MEMS and Sensing Solutions

Fairchild Semiconductor




Keynote - Trends and Challenges in Modern MEMS Sensor Packages

(Presentation in PDF)

Jiri Marek, Ph.D. (Biography)

Senior Vice President of Engineering Sensors, Automotive Electronics Division

Robert Bosch LLC





MEMS microspectrometers based on Fabry-Perot interferometers

(Presentation in PDF)

Aarne Oja (Biography)

Research Professor, Director, High Performance Microsystems Programme

VTT Technical Research Centre of Finland



Development of Silicon Interposer for Advanced Package

(Presentation in PDF)


Satoru Kuramochi (Biography)

Deputy General Manager

Next Generation MEMS Laboratory

Research and Development Center

Dai Nippon Printing Co., Ltd.






From Sensor Fusion to System Fusion

(Presentation in PDF)


Thorsten Matthias (Biography)

Director of Business Development

EV Group



Questions/Discussion (Moderator/Speakers)


Session Moderator:


Dr. Klaus-Dieter Lang (Biography)


Fraunhofer IZM


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