Integration & Implementation 2.5D & 3D

Advancing 2.5D and 3D Packaging through Value Engineering
Hosted by the Advanced Packaging Committee, SEMI Americas

Wednesday, July 10, 2013
1:00pm–3:30pm
North Hall, Moscone Center

Growing industry requirement for vertical and heterogeneous integration, as well as related packaging strategies, remains a crucial focus for many forward-looking semiconductor supply chain players. While the implementation timeline of true 3D packaging with TSV technology has been pushed out for many applications, a number of highly innovative solutions for interposers (2.5D) are already hitting the market. However, improving process yield and lowering the cost relative to alternatives are proving resilient bottlenecks to mainstream 2.5D and 3D packaging. Clearly, headway hinges on the delivery of value appropriate to the function.

For an industry seeking progression of 2.5D, as well as an effective value/function equation for 3D, it appears that success can partly be found in the innovation and evolution of equipment and materials. This session will take a critical look at supply chain ecosystem participants who are pioneering tools and materials, exclusively geared towards high volume implementation of 2.5D and 3D packaging.

Agenda

		Co-chairs of Invited Speaker Session: Bill Chen, Director, Senior Technical Advisor, ASE (U.S.), Inc. Dr. Li Li, Distinguished Engineer, Cisco Systems, Inc.

1:00pm-1:25pm		Keynote: Advancing 2.5D & 3D Packaging Through Value Engineering Ronald Steger (Biography) Partner-in-Charge KPMG Global Semiconductor Practice KPMG

1:25pm-1:50pm		Keynote: TSV/3D Technology Developments by ASET Japan (Results and Challenges) Hiroaki Ikeda (Biography) General Manager ASET (Association of Super-Advanced Electronics Technologies)

1:50pm-2:15pm		Keynote: Developing High Density Packaging with Low Cost Stacking Solution John Xie, Ph.D. (Biography) Director, Packaging Technology R&D, 3DIC and Advanced Stacking Technology and Integration Altera Corporation

2:15pm-3:30pm		Infrastructure Panel
		Co-chairs of Panel Session: Bill Bottoms, CEO, Third Millennium Test Solutions, Inc. (3MTS) E. Jan Vardaman, President, TechSearch International Panelists:

		Ron Huemoeller (Biography) Senior Vice President, Advanced Product Platform Development Amkor Technology

		Calvin Cheung Vice President of Engineering ASE Group

		Itsuo Watanabe Executive Officer Hitachi Chemical

		Raj Pendse (Biography) Vice President & Chief Marketing Officer STATS ChipPAC

		Thomas Walsh (Biography) President TEL NEXX

		Kurt Huang (Biography) Director, Corporate Marketing United Microelectronics Corporation (UMC)

View Schedule of Events

How to Register for this Program

I'm Already Registered for SEMICON West

I Have Not Registered for SEMICON West

Begin a new registration form and select this program and any others you wish to attend during Step 2.

Search