TechXPOT NOrth logo

 

Advancing 2.5D and 3D Packaging through Value Engineering
Hosted by the Advanced Packaging Committee, SEMI Americas

 

Wednesday, July 10, 2013
1:00pm
3:30pm
North Hall, Moscone Center

 
Growing industry requirement for vertical and heterogeneous integration, as well as related packaging strategies, remains a crucial focus for many forward-looking semiconductor supply chain players. While the implementation timeline of true 3D packaging with TSV technology has been pushed out for many applications, a number of highly innovative solutions for interposers (2.5D) are already hitting the market. However, improving process yield and lowering the cost relative to alternatives are proving resilient bottlenecks to mainstream 2.5D and 3D packaging. Clearly, headway hinges on the delivery of value appropriate to the function.

For an industry seeking progression of 2.5D, as well as an effective value/function equation for 3D, it appears that success can partly be found in the innovation and evolution of equipment and materials. This session will take a critical look at supply chain ecosystem participants who are pioneering tools and materials, exclusively geared towards high volume implementation of 2.5D and 3D packaging.  

 

Agenda

 

Co-chairs of Invited Speaker Session:

Bill Chen, Director, Senior Technical Advisor, ASE (U.S.), Inc.

Dr. Li Li, Distinguished Engineer, Cisco Systems, Inc.

 


1:00pm-1:25pm

Keynote: Advancing 2.5D & 3D Packaging Through Value Engineering

(Presentation in PDF)

 

Ronald Steger (Biography)

Partner-in-Charge KPMG Global Semiconductor Practice

KPMG 




1:25pm-1:50pm

      

 

Keynote: TSV/3D Technology Developments by ASET Japan (Results and Challenges)

(Presentation in PDF)

 

Hiroaki Ikeda (Biography)

General Manager

ASET (Association of Super-Advanced Electronics Technologies)

 

1:50pm-2:15pm

 

Keynote: Developing High Density Packaging with Low Cost Stacking Solution

(Presentation in PDF)

 

John Xie, Ph.D. (Biography)

Director, Packaging Technology R&D, 3DIC and Advanced Stacking Technology and Integration

Altera Corporation 


2:15pm-3:30pm Infrastructure Panel

Co-chairs of Panel Session:

Bill Bottoms, CEO,
Third Millennium Test Solutions, Inc. (3MTS)

E. Jan Vardaman, President, TechSearch International

 

 

Panelists:

 


 

Ron Huemoeller (Biography)

Senior Vice President, Advanced Product Platform Development

Amkor Technology

 

Calvin Cheung (Biography)

Vice President of Engineering

ASE Group

 

 

Itsuo Watanabe (Biography)

Executive Officer

Hitachi Chemical

 

  

 

Raj Pendse (Biography)

Vice President & Chief Marketing Officer

STATS ChipPAC

 

Thomas Walsh (Biography)

President

TEL NEXX

 



 

 

Kurt Huang (Biography)
Director, Corporate Marketing

United Microelectronics Corporation (UMC)

 


View Schedule of Events

 

 

How to Register for this Program

 

 

I'm Already Registered for SEMICON West

I Have Not Registered for SEMICON West



Login to the Registration Resource Center and select “Agenda Builder” to add this program. Begin a new registration form and select this program and any others you wish to attend during Step 2.
Bookmark and Share Google+