Mobile electronics, with a huge spotlight on the thriving smartphone and tablet  market,  are fueling growth in semiconductors today, a trend expected to escalate over the years ahead. 'Generation Mobile' relates to consumers worldwide who now rely on such products as a way of life. As demand intensifies for higher performance, greater functionality, and lower power consumption, our industry is experiencing a strong wave of innovation, inspired by those willing to push boundaries and make these increasingly sophisticated products a reality. IC packaging has firmly established itself as a crucial part of the IC and system design process. In that vein, session speakers will discuss today's IC packaging solutions, as well as, explore possibilities for future packaging technologies being poised to enable 'generation mobile' to flourish and infiltrate lifestyles around the globe.

Session Co-chairs:

Tom Gregorich, Director, Package Engineering, Broadcom Corporation

Rich Rice, Sr. VP of Sales, ASE

Keynote - A Look Inside Smartphones and Tablets: New Devices and Trends

Dr. John Scott-Thomas (Biography)
Product Marketing Manager, Semiconductor
TechInsights

Generation Mobile - Application and Baseband Processors

Roger St. Amand (Biography)

Vice President, 3D CSP

Amkor Technology

High Performance Low Power Memory Trend

Minho Kim (Biography)

Senior Manager, Technical Marketing

SK Hynix

Wafer Level Packaging Technologies for Mobile Devices

John Hunt (Biography)

Director of Engineering, Product Promotion

ASE (US), Inc.

Trends and Packaging Technologies in Module Products for Mobile Devices

Dr. Harrison Chang (Biography)
Vice President, General Manager of Miniaturized Product Business Unit

Universal Scientific Industrial Co., Ltd (USI)

Closing Remarks

Rich Rice

Senior Vice President of Sales

ASE

Tom Gregorich

Director, Package Engineering

Broadcom Corporation

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