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Generation Mobile:  Enabled by IC Packaging Technologies

Hosted by the Advanced Packaging Committee, SEMI Americas


Tuesday, July 9, 2013
North Hall, Moscone Center


Mobile electronics, with a huge spotlight on the thriving smartphone and tablet  market,  are fueling growth in semiconductors today, a trend expected to escalate over the years ahead. 'Generation Mobile' relates to consumers worldwide who now rely on such products as a way of life. As demand intensifies for higher performance, greater functionality, and lower power consumption, our industry is experiencing a strong wave of innovation, inspired by those willing to push boundaries and make these increasingly sophisticated products a reality. IC packaging has firmly established itself as a crucial part of the IC and system design process. In that vein, session speakers will discuss today's IC packaging solutions, as well as, explore possibilities for future packaging technologies being poised to enable 'generation mobile' to flourish and infiltrate lifestyles around the globe.


Session Co-chairs:

Tom Gregorich, Director, Package Engineering, Broadcom Corporation

Rich Rice, Sr. VP of Sales, ASE





Keynote - A Look Inside Smartphones and Tablets: New Devices and Trends

(Presentation in PDF)


Dr. John Scott-Thomas (Biography)
Product Marketing Manager, Semiconductor



Generation Mobile - Application and Baseband Processors

(Presentation in PDF)


Roger St. Amand (Biography)

Vice President, 3D CSP

Amkor Technology




High Performance Low Power Memory Trend

(Presentation in PDF)


Minho Kim (Biography)

Senior Manager, Technical Marketing

SK Hynix



Wafer Level Packaging Technologies for Mobile Devices

(Presentation in PDF)


John Hunt (Biography) 

Director of Engineering, Product Promotion

ASE (US), Inc.



Trends and Packaging Technologies in Module Products for Mobile Devices

(Presentation in PDF)


Dr. Harrison Chang (Biography)
Vice President, General Manager of Miniaturized Product Business Unit

Universal Scientific Industrial Co., Ltd (USI)




Closing Remarks


Rich Rice (Biography)

Senior Vice President of Sales


Session Moderator:


Tom Gregorich (Biography)

Director, Package Engineering

Broadcom Corporation


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