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Still a Tale of Two Paths: Multi-patterning Lithography at 20nm and Below: EUVL Source and Infrastructure Progress


Wednesday, July 10, 2013
10:30am
12:35pm
South Hall, Moscone Center

     

Though progress to take EUVL into the realm of high-volume manufacturing continues to be made, the readiness of the source technologies to take on HVM are still not known with a high degree of certainty. The challenges facing source development are still average power, dose stability and uptime. EUV mask and resist infrastructure readiness activities must also come together in time and address such challenges as defect density (for masks), and line edge roughness, sensitivity, and resolution for resists. No doubt, there will be multiple opportunities to insert EUVL into lower volume production lines - such opportunities will be based on specific products and device applications. Until EUVL is ready for HVM, the industry must continue to rely on double-patterning and even multiple-patterning lithography schemes using 193 immersion lithography to take it beyond 22nm. Speakers will present the current status of EUVL readiness, as well as discuss the current plans and challenges of extending 193i with double and multiple-patterning.

     

 

10:30am-10:55am

ArF Lithography Extension Through Advanced Overlay and Imaging Solutions
(Presentation in PDF)


Stephen Renwick, Ph.D. (Biography)
Sr. Research Scientist

Nikon Research Corporation of America


 
10:55am-11:20am

EUV Status and Outlook
(Presentation in PDF)


Stefan Wurm, Ph.D. 
(Biography)
Director of Lithography

SEMATECH

 

 
11:30am-11:45am
ASML’s NXE Platform Performance and Volume Introduction
(Presentation in PDF)

Skip Miller (Biography)
Director of Strategic Marketing

ASML


 
11:45am-12:10pm

Fostering a Collaboration Ecosystem to Drive Directed Self- Assembly Development

(Presentation in PDF)

Ben Rathsack, Ph.D. (Biography)

Manager, CLEAN TRACK Advanced Technology Group,  Member of Technical Staff for the Semiconductor Production Equipment (SPE) Division

Tokyo Electron America

   
12:10pm-12:35pm

Collaboration to Deliver Lithography Solutions
(Presentation in PDF)
 

Mike Rieger (Biography)

Group Director, R&D, Silicon Engineering Group

Synopsys

 
Session Moderator:

 

Vivek Bakshi (Biography)

Founder and President of EUV Litho, Inc

 


 

 

 
 

 

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